Thermal Imaging Camera Shutter Using PCB Composite Structure
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Solution Overview
Problem
Thermal imaging cameras face challenges in providing a uniform thermal scene and accurate calibration due to the limitations of traditional metallic shutters, which are costly, difficult to maintain, and require complex emissivity coatings.
Innovation Solution
A shutter with a thermally and electrically insulating substrate, featuring a first section with a thermally and electrically conductive layer for uniform temperature and high-emissivity coating to minimize reflections, and a second section with a low-emissivity coating to reflect incident energy, along with thermal relief cuts to prevent heat flow and an integrated temperature sensor for calibration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional metallic shutters are used, then the shutter can block infrared radiation, but the shutter becomes easily bent, difficult to maintain as a flat surface, and requires painting processes to create proper emissivity surfaces
Solution Approach 1:
The patent uses a composite structure consisting of a substrate (such as FR-4 circuit board material) with conductive layers, insulating layers, and emissivity coatings applied thereon. This composite construction provides both mechanical stability to maintain a flat surface and the necessary thermal/electromagnetic properties without requiring traditional metallic materials and their associated painting processes.
Solution Approach 2:
The patent replaces the traditional metallic mechanical structure with a printed circuit board-based structure that has conductive traces and layers. This substitution eliminates the need for metallic shutter blades that are prone to bending and requires complex painting processes, while achieving the same functional goals of blocking radiation and providing uniform thermal characteristics.
2Measurement precision
If a temperature sensor is incorporated into the shutter, then the temperature can be measured for calibration purposes, but the cost increases and other functions of the shutter may be negatively impacted
Solution Approach 1:
The patent integrates the temperature sensor directly into the shutter assembly, merging the temperature measurement function with the shutter's structural and optical functions. The sensor is positioned to measure the temperature of the shutter surface that presents a uniform thermal scene to the detector, enabling calibration without requiring separate measurement systems or increasing overall device complexity significantly.
Solution Approach 2:
The shutter assembly serves multiple functions: it blocks infrared radiation when closed, presents a uniform thermal scene for calibration when open, provides a mounting surface for the temperature sensor, and integrates electrical connections for both the sensor and actuator. This multi-functionality reduces the need for separate components and minimizes overall system complexity.
3Stability of the object's composition
If a thermally and electrically conductive layer is added to the shutter, then uniform temperature is achieved, but the substrate must provide thermal and electrical insulation which adds complexity
Solution Approach 1:
The patent divides the shutter into distinct functional layers: a substrate providing mechanical support and electrical insulation, conductive layers for thermal and electrical conduction, insulating layers to prevent unwanted heat transfer, and emissivity coatings for thermal radiation control. Each layer performs a specific function, and the segmentation allows for optimized material selection and simplified manufacturing compared to monolithic structures.
Solution Approach 2:
The patent applies different material properties to different regions and layers of the shutter structure. The substrate provides electrical insulation and mechanical strength, while specific conductive layers provide thermal conduction where needed. Insulating layers are positioned to block thermal paths where uniform temperature is critical, and emissivity coatings are applied to surfaces where thermal radiation control is required. This localized optimization achieves temperature uniformity without requiring the entire structure to have uniform properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a more efficient and cost-effective shutter that provides a uniform thermal scene, minimizes internal reflections, and facilitates accurate calibration, improving the performance of thermal imaging cameras.
Implementation Method 1
comprise a thermally and electrically conductive layer and a high-emissivity layer to encourage uniform temperature and minimize internal reflections
Implementation Method 2
high-emissivity layer to encourage uniform temperature and minimize internal reflections
Implementation Method 3
The second section of the shutter may comprise a low-emissivity coating for reflecting away energy incident on the shutter
Implementation Method 4
a thermally and electrically conductive layer to encourage uniform temperature
Implementation Method 5
a generally flat, thermally and electrically insulating substrate
Data Source
AI summary
Various embodiments of shutters for thermal imaging cameras, cameras comprising such shutters, and methods for providing such shutters are disclosed. The shutter may include a substrate with various layers and components thereon, such as a temperature sensor. The shutter may resemble a printed circuit board (PCB), utilizing efficient, cost-effective materials and methods known in the art.