PCB Thermal Management via Composite Support Layer

The patent merges the heat dissipation function directly into the PCB structure by embedding thermally conductive filler particles within the laminate layers. This integrates thermal management with the circuit board itself, eliminating the need for separate heat sinks and active cooling components, thereby reducing overall device complexity while maintaining effective heat dissipation.

The patent employs composite materials by combining traditional PCB laminate layers with thermally conductive filler particles (such as aluminum nitride or boron nitride). This creates a multi-phase composite structure that provides both mechanical support and enhanced thermal conduction within the same component, avoiding the need for additional cooling hardware.

The heat dissipation function is merged with the PCB structure itself, eliminating the need for separate metallic heat sinks and active cooling components. The thermally conductive filler particles are embedded within the existing laminate layers, so the weight increase is minimal and confined only to the filler material volume rather than adding entire cooling subsystems.

The patent changes the thermal conductivity parameter of the PCB laminate by incorporating filler particles with high thermal conductivity (e.g., aluminum nitride with k ≈ 28 W/m·K). This parameter modification enables effective heat dissipation without requiring the mass of traditional heat sinks, as the thermal enhancement is achieved through material composition rather than adding bulky components.

The patent uses composite materials with embedded thermally conductive filler particles to maintain effective heat dissipation in miniaturized PCB designs. The filler particles create thermal conduction pathways within the laminate structure, enabling heat to be conducted away from dense component placements without requiring additional space for heat sinks or cooling channels.

The patent applies local quality enhancement by concentrating thermally conductive filler particles in specific regions of the PCB where heat generation is highest. This localized thermal management approach allows efficient heat dissipation from critical components while maintaining the miniaturized overall design, as the thermal enhancement is applied only where needed rather than uniformly throughout the entire board.