PCB with Concave Region for Chip-on-Film Mounting
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Solution Overview
Problem
The challenge is to reduce the thickness of display apparatuses while maintaining effective electrical connectivity between the display panel and the printed circuit board (PCB), as existing designs with flexible PCBs and chip-on-film configurations face limitations in minimizing bezel width and overall thickness.
Innovation Solution
A display unit configuration featuring a PCB with uneven regions, including convex and concave areas, bonded to a chip-on-film, where the display driver IC is mounted in the concave region, allowing for a thinner profile by elongating the chip-on-film parallel to the display panel and attaching it to the PCB and panel in a gravity-directed manner.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a flexible PCB and chip-on-film configuration is used to maintain electrical connectivity, then the display apparatus can function properly, but the thickness and bezel width increase
Solution Approach 1:
The chip-on-film is nested within the concave region of the PCB, with the IC mounted on the chip-on-film which is then bonded to the PCB. This nested arrangement allows the components to be housed within the existing PCB footprint, reducing the overall thickness of the display apparatus while maintaining electrical connectivity through the integrated structure.
Solution Approach 2:
The chip-on-film is elongated parallel to the display panel and bonded to the PCB in a gravity-directed manner, utilizing the vertical dimension to reduce thickness. The uneven part of the PCB with convex and concave regions creates a three-dimensional arrangement that optimizes space utilization and reduces the bezel width and overall thickness.
2Length of moving object
If the PCB is made thinner to reduce overall thickness, then the display apparatus becomes slimmer, but the structural integrity and mounting capability deteriorate
Solution Approach 1:
The PCB is designed with uneven parts including convex and concave regions, creating local variations in thickness and structure. The concave region provides a recessed area for housing the chip-on-film and IC, while the convex region maintains structural strength. This local quality variation allows the PCB to be thinner overall while maintaining sufficient structural integrity for mounting and electrical connectivity.
Data Source
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AI summary
A display unit and a display device are disclosed. The display unit includes a display panel configured to display a content thereon, a printed circuit board (PCB) configured to generate a drive signal for driving the display panel; and a chip-on-film in which a display driver integrated circuit (IC) is mounted, configured to electrically interconnect the display panel and the PCB. One side of the PCB includes an uneven part including a convex region and a concave region, and the PCB is bonded to the chip-on-film in the concave region. The display device includes the display unit and a stand.