PCB Distal Conductive Layer for Lower Thermal Resistance
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Solution Overview
Problem
Current solutions for thermal management in multi-layer printed circuit boards, such as those using gap fillers or thermal tapes, are costly, complex, and suffer from increased thermal resistance due to material thickness and material degradation, compromising both thermal and electrical performance.
Innovation Solution
A printed circuit board design featuring an insulating bulk layer with a distal conductive layer isolated by the bulk layer, allowing direct connection to a heat sink without additional insulation, utilizing the bulk layer's insulation properties for thermal conductivity while maintaining electrical isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If gap fillers or thermal tapes are used for thermal management in multi-layer PCBs, then thermal resistance is reduced, but production costs increase and device complexity increases
Solution Approach 1:
The patent extracts the thermal management function from external materials (gap fillers, thermal tapes) and integrates it directly into the PCB structure by making the distal conductive layer itself thermally conductive. This eliminates the need for separate thermal management components and their associated application processes, thereby reducing production complexity while maintaining thermal performance.
Solution Approach 2:
The patent merges the thermal management function with the PCB structure by integrating a thermally conductive distal conductive layer directly into the board. This consolidation eliminates the need for separate gap fillers or thermal tapes, reducing both device complexity and production steps while achieving effective heat transfer from the heat sink.
2Temperature
If gap fillers or thermal tapes are used for thermal management, then thermal resistance is reduced, but production costs increase
Solution Approach 1:
The patent combines the thermal management function with the PCB manufacturing process itself by incorporating a thermally conductive distal conductive layer. This integration allows thermal management to be achieved through standard PCB fabrication techniques rather than requiring additional materials and application steps, thereby reducing production costs while maintaining effective thermal contact with the heat sink.
3Reliability
If additional insulation coatings are applied to the distal surface, then electrical isolation is improved, but thermal resistance increases due to material thickness
Solution Approach 1:
The patent applies local quality by making the distal conductive layer itself thermally conductive rather than adding a separate thermal management layer. This localized modification to the distal surface provides both the necessary electrical isolation (through the insulating bulk layer) and improved thermal contact (through the thermally conductive distal layer), eliminating the trade-off between electrical isolation and thermal resistance.
4Temperature
If thermal tapes are used for thermal management, then thermal contact is improved, but device complexity and application process complexity increase
Solution Approach 1:
The patent extracts the thermal contact function from external thermal tapes and integrates it directly into the PCB structure through the thermally conductive distal conductive layer. This eliminates the need for separate thermal tape application processes, reducing application process complexity while maintaining effective thermal contact with the heat sink.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat transfer outside the PCB by leveraging the insulating bulk layer's thermal properties, reducing thermal resistance and production costs, and enabling higher component density without additional coating or complex application processes.
Implementation Method 1
Improves heat transfer outside the PCB by leveraging the insulating bulk layer's thermal properties, reducing thermal resistance
Implementation Method 2
A printed circuit board design featuring an insulating bulk layer with a distal conductive layer isolated by the bulk layer, allowing direct connection to a heat sink without additional insulation
Data Source
AI summary
The invention is directed to a printed circuit board comprising an insulating bulk layer having a proximal surface and a distal surface that is opposite to the proximal surface with one or more electrical connection elements accessible from the proximal surface of the insulating bulk layer. The electrical connection elements are configured to connect electrical components to be arranged on the proximal surface of the insulating bulk layer, wherein the distal surface is at least partially covered by a distal conductive layer that is electrically isolated from the electrical connection elements.