Printed Circuit Board Conductive Via Shielding
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Solution Overview
Problem
The increasing trend of miniaturization and high-density circuits in portable electronic devices leads to enhanced electromagnetic interference (EMI) due to electromagnetic noise, which existing technologies struggle to effectively mitigate.
Innovation Solution
A printed circuit board design incorporating conductive vias with multiple metal layers of varying magnetic permeability, where a first metal layer with low permeability, such as copper, is combined with a second metal layer having higher permeability, like an iron-nickel alloy, to enhance electromagnetic shielding without increasing the size of the conductive vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a single metal layer with high magnetic permeability is used in conductive vias, then electromagnetic shielding effectiveness is improved, but the thickness of the shielding layer increases
Solution Approach 1:
The conductive via is constructed with a composite structure comprising a first metal layer with low magnetic permeability (such as copper or aluminum) and a second metal layer with high magnetic permeability (such as nickel or iron-nickel alloy). This composite material approach allows the shielding structure to achieve effective electromagnetic interference suppression while maintaining a reduced overall thickness, as each metal layer contributes different protective characteristics against EMI.
Solution Approach 2:
Different metal layers are applied to different portions of the conductive via structure based on their specific electromagnetic shielding properties. The low permeability metal layer provides baseline shielding, while the high permeability metal layer is strategically positioned to target specific frequency ranges or directional interference, creating localized quality variations that optimize overall shielding effectiveness without uniform thickness increase.
2Object-affected harmful factors
If multiple metal layers with different magnetic permeability are used in conductive vias, then electromagnetic shielding effectiveness is improved, but device complexity increases
Solution Approach 1:
The conductive via structure employs a nested configuration where the first metal layer with low magnetic permeability forms the inner or base layer, and the second metal layer with high magnetic permeability is deposited over or around it. This nesting arrangement allows multiple functional layers to be integrated within a single via structure, achieving enhanced shielding without proportionally increasing overall device complexity.
Solution Approach 2:
The invention utilizes parameter changes in material properties (magnetic permeability) across different layers rather than changing the fundamental structure. By varying only the magnetic permeability parameter of the metal layers while maintaining a consistent via geometry and placement pattern, the design achieves improved shielding performance without significantly increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides improved noise reduction with thinner shielding layers, allowing for more conductive vias and better design flexibility while maintaining effective electromagnetic shielding, reducing signal interference and design constraints.
Implementation Method 1
a conductive via for shielding electromagnetic waves using a plurality of metal layers having different degrees of magnetic permeability
Implementation Method 2
The conductive via may include first and second metal layers having different degrees of magnetic permeability
Data Source
AI summary
A printed circuit board includes an insulating body, a wiring structure at least disposed on the insulating body; and a shielding portion including a conductive via disposed around the wiring structure of the insulating body. The conductive via includes first and second metal layers having different degrees of magnetic permeability.