Interlocking PCB Conductor Projections for Thermal Management
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Solution Overview
Problem
The temperature resistance of standard printed circuit boards is limited, leading to issues such as delamination, bending, and loss of electrical functionality at higher temperatures, and inadequate heat dissipation due to poor thermal conductivity and straight conductor track layouts, which restrict effective heat transfer between components and the environment.
Innovation Solution
The implementation of complementary sets of projections on the boundary surfaces of conductor tracks, which interlock to maintain electrical insulation while increasing the surface area for heat dissipation, allowing for improved thermal management and heat transfer between adjacent tracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductor tracks are arranged with straight boundary surfaces for electrical insulation, then electrical insulation is maintained, but heat dissipation capability deteriorates
Solution Approach 1:
The boundary surfaces of adjacent conductor tracks are equipped with complementary projections (microprotrusions and microdepressions) that create a curved, interlocking geometry. This replaces the straight boundary surfaces with a profile that increases surface area while maintaining electrical insulation through the complementary fit, thereby improving heat dissipation without compromising insulation reliability.
2Temperature
If conductor track surface area is increased for heat dissipation, then heat transfer capability is improved, but electrical insulation distance may be compromised
Solution Approach 1:
The projections on one conductor track's boundary surface nest into complementary depressions on the adjacent track's boundary surface. This interlocking configuration allows the conductor tracks to be positioned closer together while maintaining adequate electrical insulation, effectively increasing the heat dissipation surface area without reducing the insulation distance.
3Area of stationary object
If printed circuit board size is reduced for compact construction, then device miniaturization is achieved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The boundary surfaces of conductor tracks are equipped with localized complementary projections that concentrate heat transfer capability at critical interfaces between adjacent tracks. This local enhancement of thermal properties allows efficient heat dissipation in compact areas, enabling compact PCB construction without sacrificing heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation capabilities, enabling better thermal management and preventing damage from excessive heat, even in compact printed circuit boards without additional heat sinks, by creating an enlarged surface area for heat transfer and allowing both in-plane and through-the-board heat spreading.
Implementation Method 1
heat can be dissipated from one another is favored... heat transfer into or through the printed circuit board or the FR4 base layer and the so-called heat spread there
Implementation Method 2
a desired heat dissipation from one conductor track to the next adjacent conductor track is achieved in order to obtain a larger surface area for heat dissipation from an operated component to the environment, i.e. a so-called heat spread
Data Source
Figure 1~4
Figure 5~9
Figure 10~11
AI summary
Printed circuit board (100) comprising a base layer (110) with a top and a bottom surface (120, 130), wherein at least the top surface (120) has at least a first layer (150) of conductors (200) provided for current conduction and at least a first and a second component (310, 320), wherein at least two conductors (200) are assigned to each component (310, 320) for control, wherein nearest adjacent conductors (200) on each side (120, 130) of the base layer (110) have interfaces (210) spaced apart from each other for mutual electrical isolation, wherein at least the interface (210) of a conductor (200) of the first component (310) has at least a section of a first set of projections (401) and the interface (210) of a conductor (200) nearest to it of the second component (320) at least section by section have a second set of projections (402),where the first set of projections (401) and the second set of projections (402) complement each other.