PCB Conductor Track Heating Circuit for Uniform Fluid Heating
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Solution Overview
Problem
Existing fluid heaters using power semiconductors for heating require complex and expensive circuit engineering to achieve even heat transfer, with the heat generation being concentrated at specific points, leading to substantial technical complexity and higher costs.
Innovation Solution
A circuit board with conductor tracks formed by a subtractive process, such as etching, is used to create a heating element integrated with a heat distribution layer, allowing for adaptable heating power levels and simplified circuitry, with the conductor tracks acting as both heating and control elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power semiconductors are used as heating elements, then heating function is achieved, but heat distribution becomes uneven and circuit complexity increases
Solution Approach 1:
The conductor tracks on the circuit board serve dual functions: they provide electrical connectivity for control electronics and simultaneously function as heating elements. This multi-functionality eliminates the need for separate heating components, reducing circuit complexity while maintaining effective heating capability.
Solution Approach 2:
The heating function is merged with the existing circuit board structure by utilizing the conductor tracks that are already present for electrical connections. This integration combines the heating element with the control circuitry substrate, simplifying the overall device architecture and reducing the number of separate components.
2Power
If power semiconductors are used for heating, then heating is achieved, but heat transfer uniformity deteriorates
Solution Approach 1:
The conductor tracks are designed with varying geometries (width, length, spacing) in different regions of the circuit board to achieve uniform heat distribution. By adjusting the local properties of the conductor tracks, the heating density is optimized across different areas, compensating for the point-source nature of the heating and achieving even heat transfer to the fluid.
3Power
If conventional heating elements are used, then heating is achieved, but circuit engineering effort and cost increase
Solution Approach 1:
The circuit board's own conductor tracks, which are already part of the standard PCB structure, are utilized to generate heat through their electrical resistance. This self-service approach eliminates the need for additional heating components and reduces circuit engineering effort, as the existing PCB infrastructure is repurposed for dual functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves uniform heat distribution and reduced complexity by utilizing the parasitic heating effect of conductor tracks, enabling efficient fluid heating with lower engineering effort and cost-effective solutions.
Implementation Method 1
The invention utilizes the parasitic side effect of the conductor track heating up when it is energized
Implementation Method 2
the heat generated by the power semiconductors is transferred to the fluid to be heated via a heat distribution element
Data Source
Figure 1~2
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AI summary
The invention relates to a printed circuit board comprising a heating circuit formed from conductor tracks, and to a heater comprising such a printed circuit board.