Thermal Isolation Plate for High-Current PCB Conductor Welding
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Solution Overview
Problem
Conventional methods for producing printed circuit boards face limitations in transmitting higher currents and routing due to the limited depth and cross-section of copper film strip conductors, particularly in one-layer or two-layer boards, and struggle with the weldability of thick wires onto thin copper films.
Innovation Solution
A method involving a thermal isolation plate with lower thermal conductivity than the conductive film, allowing for the welding of conductors with larger diameters or depths, using a device with numerically controlled movement and integral connection to electrical points, ensuring high welding quality and reliability, and maintaining effective current flow without 'hot spots'.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional etching procedures are used to produce strip conductors, then the manufacturing process is simple and economical, but the depth and cross-section of the copper film are limited, making it impossible to transmit higher currents
Solution Approach 1:
The conductor is prepared in advance with a cross-section larger than the copper film thickness before the welding process. This preliminary sizing ensures that the conductor can accommodate higher current transmission requirements before being joined to the circuit board, resolving the limitation of thin copper films.
Solution Approach 2:
The invention changes the parameter of conductor cross-section to be larger than the copper film thickness. By using conductors with depth or diameter greater than the copper film thickness and applying controlled welding with thermal isolation, the system achieves both high current capability and reliable connection.
2Power
If thick conductors are welded to thin copper films using conventional methods, then higher current transmission is achieved, but welding quality and reliability deteriorate due to poor weldability
Solution Approach 1:
A thermal isolation plate is introduced as an intermediary between the welding tool and the copper film during the welding process. This plate isolates the heat locally at the welding point while preventing excessive heat diffusion into the thin copper film, thereby enabling reliable welding of thick conductors without damaging the film.
Solution Approach 2:
The invention changes the thermal parameters of the welding process by introducing the thermal isolation plate with specific thermal conductivity properties. This allows the welding parameters (temperature, time) to be optimized for thick conductor welding while protecting the thin copper film from thermal damage.
3Power
If the conductor cross-section is increased to transmit higher currents, then power transmission capability is improved, but hot spots form in the welding region due to interference with the conductive film
Solution Approach 1:
The thermal isolation plate acts as a mediator that controls heat flow during welding. It allows sufficient heat for welding the thick conductor while preventing excessive heat accumulation that would create hot spots and interfere with the conductive film, thus maintaining safe operating temperatures.
Solution Approach 2:
The invention converts the potential harmful effect of thick conductor welding (heat generation and hot spots) into a beneficial process. By using the thermal isolation plate, the heat that would normally damage the copper film is instead controlled and directed, enabling successful welding without hot spot formation.
4Ease of manufacture
If conventional welding methods are used for thick conductors on thin films, then the process is simple, but welding quality and effective conductor cross-section progression are compromised
Solution Approach 1:
The thermal isolation plate is a simple-to-implement intermediary that significantly improves welding quality. It maintains effective conductor cross-section progression by preventing heat-induced damage to the copper film, while adding minimal complexity to the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the welding of a wide range of conductors with improved reliability and quality, allowing for high-current applications and maintaining current flow progression, while being industrially applicable and resistant to ambient conditions.
Implementation Method 1
the conductive film is in contact with a thermal isolation plate, at least during the welding process, the thermal conductivity of said plate being lower than that of the conductive film
Data Source
AI summary
A method provides for welding a conductor to a conductive film which is suited for connection to a circuit board support in order to produce a printed circuit board. The depth or diameter of the conductor is preferably greater than the thickness of the conductive film. At least during the welding process, the conductive film is maintained in contact with a thermal isolation plate having a thermal conductivity less than that of the conductive film. After being placed on the circuit board support, the conductive film is partly etched away to electrically isolate electrical contact points.