PCB with Congruent Metallized Through-Holes for Mixed Component Assembly
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Solution Overview
Problem
The production of mixed printed circuit boards with surface-mountable (SMD) and through-hole technology (THT) components is time-consuming and cost-intensive due to the manual insertion and separate soldering steps required for THT components.
Innovation Solution
A printed circuit board design featuring congruent metallized through-holes on the assembly sides of substrate layers, with an intermediate conductive layer projecting into these holes, allowing for mechanical and electrical fixation of THT components, enabling simultaneous soldering with SMDs in a single reflow step.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If manual insertion of wire-based components is used, then THT components can be mounted on PCB, but production time and cost increase significantly
Solution Approach 1:
The patent applies preliminary action by pre-forming metallized through-holes in the PCB substrate before component mounting. These pre-prepared through-holes with metallized surfaces enable wire-based components to be directly inserted and soldered in the same reflow process as SMDs, eliminating the need for manual insertion and separate soldering steps. This preliminary preparation of mounting structures allows automated assembly while maintaining THT component compatibility.
2Reliability
If separate soldering steps are used for THT and SMD components, then both component types can be soldered, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the soldering processes for THT and SMD components into a single reflow soldering step. By providing pre-formed metallized through-holes that accept wire-based component leads, both SMDs and THT components can be simultaneously soldered in one reflow process. This consolidation eliminates the need for separate wave soldering or manual soldering steps, reducing manufacturing complexity while maintaining reliable solder joints for both component types.
3Adaptability or versatility
If through-holes are formed in substrate layers, then THT component leads can be inserted, but mechanical stability of components decreases without additional holding structures
Solution Approach 1:
The patent introduces an intermediate layer with through-holes that acts as a mediator between the PCB substrate and the wire-based components. This intermediate layer provides structural support and mechanical retention for component leads inserted through the PCB. The intermediate layer's through-holes are positioned to receive and stabilize component leads, preventing them from bending or dislodging during assembly and operation, thereby enhancing mechanical stability while maintaining insertion capability.
Data Source
Figure 1a~1b
Figure 2~3
Figure 4a~4g
AI summary
The printed circuit board (10) has the through-holes formed in the component sides of the substrate layers (20,30) and lie congruently one above the other. The metal coated through-holes are electrically connected with a conducting path (21) of a conducting layer (22) of the substrate layer. An independent claim is included for a method for manufacturing a printed circuit board.