PCB Connector Grounds with Different Potentials

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Solution Overview

Problem

High-speed data transmission connectors, such as USB 3.0 and USB 3.1, experience significant electromagnetic interference (EMI) noise due to the electric field generated during signal exchange, which degrades wireless communication performance, and existing ground systems with the same potential are insufficient in reducing this noise.

Innovation Solution

A printed circuit board (PCB) design featuring a connector with two grounds of different potentials, where the second ground is physically isolated and electrically connected to another conductive portion, effectively distributing and reducing the noise across the PCB and the electronic device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a connector supporting high-speed data transmission is used, then data transmission speed is improved, but noise floor increases

Engineering Contradiction:
Improvedata transmission speedVSAvoidnoise floor
Core Design Contradiction:
SpeedVSObject-generated harmful factors

Solution Approach 1:

The ground system is segmented into two separate grounds with different potentials. The first ground is electrically connected to the connector and the second ground is physically isolated from the first ground, allowing noise to be distributed and reduced across the two separate ground systems rather than accumulating in a single ground plane.

Inventive Principle:
Principle #1Segmentation

2Object-generated harmful factors

If a ground having the same potential as the connector is used, then noise reduction is improved, but high noise floor in high-speed connectors cannot be reduced

Engineering Contradiction:
ImprovenoiseVSAvoidnoise reduction effectiveness
Core Design Contradiction:
Object-generated harmful factorsVSAdaptability or versatility

Solution Approach 1:

Different regions of the ground system are assigned different potentials and functions. The first ground region is electrically connected to the connector and operates at connector potential, while the second ground region is physically isolated and operates at a different potential, providing specialized noise reduction for high-speed data transmission applications.

Inventive Principle:
Principle #3Local quality

3Object-generated harmful factors

If two grounds with different potentials are used, then noise distribution is improved, but device complexity increases

Engineering Contradiction:
Improvenoise distributionVSAvoidground system complexity
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The second ground is extracted as a physically isolated component from the first ground system. This separation allows the noise reduction function to be performed by the isolated second ground without interfering with the primary ground system, simplifying the overall design while maintaining effectiveness.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design significantly reduces the high noise floor associated with high-speed data transmission connectors, enhancing the electric influence and maintaining the performance of wireless communication by distributing noise to the second ground or connected conductive portions.

Implementation Method 1

an electric field may be generated in the connector due to a flow of a current, and this electric field may cause electro magnetic interference (EMI)

Methodology Applied
Scientific EffectElectromagnetic interference: Electromagnetic Induction

Data Source

PatentEP3578019B1PCB including connector and grounds with different potentials, and electronic device having the same
Publication Date: 2020.12.23 SAMSUNG ELECTRONICS CO LTD
  • EP3578019B1 patent drawingFigure 1
  • EP3578019B1 patent drawingFigure 2
  • EP3578019B1 patent drawingFigure 3

AI summary

An electronic device according to an example embodiment includes: a substrate; and a connector including a plurality of terminals disposed on a first area of the substrate, wherein the substrate includes: a first layer including signal lines connected to the plurality of terminals and a dielectric material disposed between the signal lines; a second layer disposed on the first layer, and including a first ground electrically connected with the connector and a second ground physically isolated from the first ground; a third conductive layer disposed on the second layer, and electrically connected with the second ground; and a fourth layer having a nonconductive material disposed on an area corresponding to the first area between the second layer and the third conductive layer.