PCB Power Connector Assembly With Heat Spreading Block Cooling
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Solution Overview
Problem
Power connectors in printed circuit boards generate significant heat due to high currents, but lack effective cooling mechanisms as there is no even surface for a heat spreader or heat sink to connect to, limiting cooling options to natural or forced convection through the conductive layer.
Innovation Solution
A heat spreading block is positioned at the lower surface of the printed circuit board, with pins of the power connector protruding through plated through-holes to enable direct heat conduction, and can be connected to a heat sink for enhanced cooling via thermal interface material, utilizing materials with high thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power connectors are used to provide high currents, then electrical connection performance is improved, but heat generation increases
Solution Approach 1:
The patent converts the harmful heat generated by high-current power connectors into a manageable thermal conduction problem. By providing protruding pin ends that extend beyond the PCB surface, the design enables direct thermal contact with heat spreading blocks, transforming the waste heat into a controllable thermal flow that can be efficiently managed through conductive materials.
Solution Approach 2:
The patent introduces heat spreading blocks as intermediary thermal management components. These blocks serve as mediators between the heat-generating power connector pins and the final heat dissipation path, enabling efficient thermal transfer through their high thermal conductivity and geometric design that maximizes contact area with both the pins and the PCB.
2Temperature
If conventional cooling methods are used, then cooling capability is limited, but there is no even surface for heat spreader connection
Solution Approach 1:
The patent segments the thermal management function into distinct components: the power connector pins, the heat spreading blocks, and the heat sink. This segmentation allows each component to be optimized independently - the pins provide electrical connection, the heat spreading blocks provide thermal conduction and surface evenness, and the heat sink provides final heat dissipation.
Solution Approach 2:
The patent transitions from two-dimensional surface contact to three-dimensional volumetric thermal management. By having pins protrude from the PCB surface and heat spreading blocks positioned in this third dimension, the design creates multiple contact surfaces and thermal pathways, enabling effective heat spreading without being constrained by the limited even surface area on the PCB.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved cooling performance by direct heat conduction and convection, effectively managing heat generated by high-current power connectors.
Implementation Method 1
The present embodiments are thus based on the idea of providing a heat spreading block at the lower surface of the printed circuit board that serves to cool the plurality of pins of the power connector. Such cooling is primarily through heat conduction.
Implementation Method 2
the power connector pins are pressed into the holes by a press-fit connection or a shrink-fit connection. By implementing a press-fit or shrink fit connection of the pins in the holes of the heat spreading block, a good thermal contact between the plurality of pins and the heat spreading block may be achieved.
Data Source
AI summary
A printed circuit board assembly includes a printed circuit board and a power connector. The printed circuit board includes an upper surface, a lower surface, and plated through-holes. The power connector is arranged at the upper surface of the printed circuit board and includes a plurality of pins extending through the plated through-holes. The plurality of pins are configured to extend through the plated through-holes and protrude from the lower surface of the printed circuit board. A heat spreading block located at the lower surface is provided. Ends of the plurality of pins are arranged in the heat spreading block.