Integrated PCB Connector Layout for RF and Baseband Isolation
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Solution Overview
Problem
The large footprint of connectors on circuit boards due to separate arrangements for radio frequency and baseband signals leads to a larger circuit board size, limiting the size of other components in electronic devices.
Innovation Solution
An electrical connection structure with stacked metal layers and spaced reference grounds to transmit different signal types, reducing the need for separate connectors and minimizing interference, while using insulating reinforcing members to enhance structural strength and isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If connectors for radio frequency signal and baseband signal are independently arranged and spaced apart, then interference between signals is reduced, but the footprint of connectors on the circuit board increases
Solution Approach 1:
The patent combines the radio frequency connector and baseband connector into a single integrated connector structure. The connector includes both RF terminals and baseband terminals arranged in a unified housing, allowing both signal types to be transmitted through one connector rather than requiring separate spaced-apart connectors. This merging reduces the overall footprint while maintaining signal isolation through internal design features.
Solution Approach 2:
The patent implements a nested arrangement where baseband terminals are positioned within the spatial envelope of the radio frequency connector structure. Specifically, the baseband terminals are arranged in a second row that is partially overlapped by the RF terminal housing, creating a compact nested configuration. This nesting allows both connector types to share the same physical space, reducing the total area occupied on the circuit board while maintaining electrical isolation between signal paths.
2Reliability
If a large quantity of connectors are arranged on the circuit board, then signal transmission requirements are met, but the size of the circuit board increases
Solution Approach 1:
The patent merges multiple connector functions into a single integrated connector unit that handles both radio frequency and baseband signals. This consolidation reduces the total number of discrete connectors required on the circuit board, thereby reducing the overall board size while maintaining complete signal transmission capability for both signal types through the unified connector structure.
Solution Approach 2:
The integrated connector serves multiple functions simultaneously: it provides both RF signal transmission and baseband signal transmission through its unified structure. The connector housing accommodates both RF terminals and baseband terminals, making it a multi-functional component that replaces what would traditionally require separate dedicated connectors, thus reducing board area while maintaining full signal transmission requirements.
3Object-affected harmful factors
If connectors are spaced apart by a particular distance, then crosstalk between signals is reduced, but the available volume for other components decreases
Solution Approach 1:
The patent employs a nested arrangement where baseband terminals are positioned within the spatial boundaries of the RF connector housing. The baseband terminals in the second row are partially overlapped by the RF terminal structure, creating a compact nested configuration that minimizes the overall volume occupied by the connector assembly. This nesting reduces the space required compared to spaced-apart arrangements, thereby increasing available volume for other components like batteries while maintaining signal isolation through careful terminal positioning and shielding design.
Data Source
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AI summary
This application provides an electrical connection structure and an electronic device, and relates to the field of interconnection technologies of a circuit board, to reduce a size of a circuit board and increase sizes of other components around the circuit board. The electrical connection structure includes a circuit board, a first connector, a third group of terminals, and a fourth group of terminals. The circuit board includes a first group of signal traces, a second group of signal traces, a first reference ground, and a second reference ground. The first reference ground and the second reference ground are spaced apart from each other. The first connector is arranged on the circuit board. The first connector includes a first group of terminals and a second group of terminals. The third group of terminals are electrically connected to the first group of terminals by using the first group of signal traces and the first reference ground. The fourth group of terminals are electrically connected to the second group of terminals by using the second group of signal traces and the second reference ground. The electrical connection structure provided in this application is used for circuit board interconnection.