PCB Contact Structure for High-Frequency Switching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional electromechanical switches are limited to processing low-frequency signals and face challenges in cost and mass production when trying to handle high-frequency signals, and MEMS switches, while capable for high-frequency signals, have stability issues due to static friction and complex manufacturing processes.
Innovation Solution
A contact structure using a PCB-based construction with a moving contact, capable of various actuations, and designed for low driving voltage, allowing for efficient processing of signals from DC to microwave frequencies with low insertion loss and high isolation, and suitable for low-cost mass production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If traditional contact structure with mechanical design is used, then DC or extremely low frequency signals can be transmitted, but high frequency signal processing capability is lost
Solution Approach 1:
The patent replaces the traditional mechanical contact structure with a PCB-based construction where signal transmission occurs through conductive paths on the PCB board. This substitution enables high-frequency signal processing by eliminating mechanical limitations while maintaining the switching function through electromagnetic field coupling between contact structures.
2Speed
If MEMS switch is used to achieve high frequency signal processing, then signal processing capability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent changes the manufacturing parameters and materials from complex MEMS semiconductor fabrication to standard PCB manufacturing processes. By using conventional PCB materials and assembly techniques, the invention achieves high-frequency performance without the repeated oxidizing, depositing, transferring, and etching processes required for MEMS, thereby simplifying manufacturing and reducing costs.
Solution Approach 2:
The patent uses PCB-based contact structures that replicate the switching function of MEMS devices through a different physical implementation. The PCB-based design copies the essential functionality of high-frequency switching without requiring complex MEMS fabrication, offering a simpler alternative that can be mass-produced using standard PCB techniques.
3Speed
If MEMS switch is used to achieve high frequency signal processing, then signal processing capability is improved, but production cost increases
Solution Approach 1:
The patent employs inexpensive PCB materials and standard electronic components to create contact structures that achieve high-frequency performance at lower cost. Rather than using expensive MEMS fabrication processes, the invention uses readily available PCB stock materials and conventional assembly methods, making the solution more economically viable for mass production.
4Speed
If MEMS switch is used, then high frequency signal processing is enabled, but stability is reduced due to static friction and charged dielectric effects
Solution Approach 1:
The patent replaces the mechanical MEMS actuation system with a PCB-based contact structure that uses electromagnetic field coupling. This substitution eliminates the static friction and charged dielectric layer interference problems inherent in MEMS, providing more stable and reliable actuation for high-frequency signal processing applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides stable switch characteristics with low insertion loss and high isolation, reduces manufacturing costs, and simplifies the production process while enabling the processing of high-frequency signals up to 1 GHz, overcoming the limitations of traditional switches and MEMS switches.
Implementation Method 1
The contact structure of this invention allows many kinds of actuations, such as electrostatic force, electro-magnetic force, piezoelectric effect, or heat effect.
Implementation Method 2
The contact structure of this invention allows many kinds of actuations, such as electrostatic force, electro-magnetic force, piezoelectric effect, or heat effect.
Implementation Method 3
The contact structure of this invention allows many kinds of actuations, such as electrostatic force, electro-magnetic force, piezoelectric effect, or heat effect.
Implementation Method 4
The contact structure of this invention allows many kinds of actuations, such as electrostatic force, electro-magnetic force, piezoelectric effect, or heat effect.
Data Source
AI summary
A contact structure for electromechanical switch includes a static contact and a moving contact to allow many kinds of actuations and provide great switch characteristics, such as high isolation and low insertion loss, for using in the applicable range from DC to high frequency microwave. In the contact structure, there is a gap disposed between the static contact and the moving contact so that the static contact and the moving contact are parallel with each other.