Dielectric Backing Plate Isolates PCB Contacts in Medical Devices
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Solution Overview
Problem
Existing electrical connectors in medical imaging devices require complex manufacturing processes to achieve effective electrical isolation of contacts, often resulting in overdrilling issues due to misorientation of laser drilling, which degrades connection quality.
Innovation Solution
A simplified two-layer printed circuit board (PCB) construction using a dielectric backing plate with openings aligned with contacts, secured by a low or no flow polymer resin layer, which isolates contacts from the exterior while allowing effective electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multi-layer PCB construction with vias is used to isolate electrical contacts, then electrical isolation effectiveness is improved, but manufacturing complexity and process steps increase
Solution Approach 1:
The PCB is divided into two separate layers: a contact layer containing electrical contacts and a backing plate layer providing isolation. This segmentation allows each layer to be optimized independently and simplifies manufacturing compared to complex multi-layer constructions with vias.
Solution Approach 2:
The isolation function is extracted from the internal via structure and implemented by a separate backing plate layer. This removes the need for complex via drilling and isolation processes, replacing them with a simpler lamination process.
2Reliability
If laser drilling is used to create vias through the isolation layer, then electrical isolation is achieved, but misorientation causes overdrilling that degrades contact connection quality
Solution Approach 1:
Instead of attempting to prevent overdrilling through precise laser orientation, the invention accepts that some overdrilling may occur but designs the backing plate with sufficient thickness and material properties that the resin layer prevents contact degradation even when vias are slightly overdrilled.
3Manufacturing precision
If larger pads are used around contacts to prevent laser overdrilling, then contact protection is improved, but manufacturing process complexity increases
Solution Approach 1:
The protection function is extracted from the pad geometry and implemented by the backing plate layer with resin filling. This allows standard-sized pads to be used without compromising contact protection, simplifying the manufacturing process.
4Ease of manufacture
If a simplified two-layer construction is used, then manufacturing process is simplified, but electrical isolation effectiveness must be maintained
Solution Approach 1:
The PCB uses composite construction with a dielectric backing plate layer combined with resin material to achieve effective electrical isolation. This composite approach maintains isolation reliability while simplifying manufacturing compared to traditional multi-layer PCBs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This construction significantly simplifies the manufacturing process while ensuring effective electrical isolation and connection quality, preventing contact with operators and maintaining reliable electrical connections.
Implementation Method 1
The backing layer is affixed to the board over the contacts by a resin layer having an aperture cut into the layer. The resin layer is a low or no flow polymer material that can be used to adhere the backing layer to the board.
Data Source
AI summary
In the present invention, an electrical connector is formed with contacts on one side of a printed circuit board that are electrically coupled through the board in a known manner. A backing plate formed of a dielectric material is applied to the board over the contacts. The backing plate includes openings extending through the backing plate that are in alignment with the contacts in order to allow electrical connections to be made with the contacts, but while also isolating the contacts from the exterior surface of the backing layer. The backing layer is affixed to the board over the contacts by an adhesive resin layer having an aperture cut into the layer. The aperture cut into the layer surrounds the contacts on the board, and due to the low or no flow nature of the resin, does not flow onto the contacts to cover the contacts.


