Built-In Component PCB Cooling with Closed Coolant Flow Path
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Solution Overview
Problem
Circuit boards with built-in components face poor heat dissipation due to high thermal resistance, leading to increased component temperatures and reduced reliability.
Innovation Solution
A circuit board design featuring a first and second conductive wiring layer, an insulating layer with a built-in electronic component, a heat dissipating layer, and a second insulating layer with a closed coolant flow path that thermally connects the electronic component to the heat dissipating layer, enhancing heat dissipation without requiring additional structures or power for coolant drive.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are mounted inside a printed board to increase circuit density, then miniaturization is achieved, but heat dissipation deteriorates due to high thermal resistance
Solution Approach 1:
The patent divides the heat dissipation function into multiple segments: thermal vias for vertical heat transfer, heat dissipating layers for lateral heat distribution, and coolant flow paths for active cooling. This segmentation allows heat to be dissipated through multiple pathways, reducing thermal resistance without increasing overall board size.
Solution Approach 2:
The patent introduces thermal vias and heat dissipating layers as intermediary structures between the built-in components and the coolant flow paths. These intermediaries facilitate efficient heat transfer from the components to the coolant, resolving the thermal resistance issue while maintaining the compact built-in configuration.
2Temperature
If thermal via structures are used for heat dissipation, then heat transfer path is provided, but thermal resistance remains high leading to component temperature rise
Solution Approach 1:
The patent employs composite heat dissipation structures combining thermal vias filled with high-thermal-conductivity materials, heat dissipating layers made of thermally conductive materials, and coolant flow paths. This composite approach creates a multi-material thermal management system that significantly reduces thermal resistance compared to using thermal vias alone.
Solution Approach 2:
The patent transitions from one-dimensional heat transfer through thermal vias to three-dimensional heat dissipation by incorporating heat dissipating layers that spread heat laterally and coolant flow paths that provide active cooling. This dimensional expansion creates multiple heat escape routes, reducing thermal resistance and improving reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal resistance and improves heat dissipation performance, maintaining component reliability and efficiency without altering existing manufacturing processes.
Implementation Method 1
the coolant flow path thermally connects the electronic component and the heat dissipating layer
Implementation Method 2
a heat dissipating layer that has a heat dissipating part that dissipates heat generated by the electronic component
Data Source
Figure 1
Figure 2A~2B
Figure 3
AI summary
A circuit board with built-in components (1) includes: a first conductive wiring layer (10); a second conductive wiring layer (20); a first insulating layer (30) stacked to be sandwiched between the first conductive wiring layer (10) and the second conductive wiring layer (20); an electronic component (40) built in the first insulating layer (30) and electrically connected to the first conductive wiring layer (10) and the second conductive wiring layer (20); a heat dissipating layer (50) that has a heat dissipating part (70) that dissipates heat generated by the electronic component (40); and a second insulating layer (60) stacked to be sandwiched between the second conductive wiring layer (20) and the heat dissipating layer (50). Inside the second insulating layer (60), a closed coolant flow path (80) in which a coolant is enclosed is formed. The coolant flow path (80) thermally connects the electronic component (40) and the heat dissipating layer (50).