PCB Cooling Layout for Bottom-Mounted Voltage Regulators
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Solution Overview
Problem
There is a need to free up space on top of the motherboard for other components and to improve the current path resistance between the processor and the voltage regulator, while also reducing power loss and lowering the total cost of ownership of computing systems.
Innovation Solution
The solution involves placing the voltage regulator on the bottom side of the printed circuit board and using a cooling system that includes heat pipes to effectively dissipate heat from the voltage regulator and processor to a passive heat exchanger on the top side of the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the voltage regulator is placed on top of the motherboard adjacent to the processor, then the current path resistance is improved, but the space on top of the motherboard is occupied and prevents placement of other components
Solution Approach 1:
The voltage regulator is moved from the traditional top-side placement to the bottom side of the motherboard, utilizing the unused bottom surface area. This dimensional transition allows the top of the motherboard to be freed for other components while maintaining short current paths through vertical vias and trace optimization, thus resolving the space conflict without sacrificing electrical performance.
2Area of stationary object
If the voltage regulator is placed on the bottom side of the printed circuit board, then space on top is freed up, but cooling the voltage regulator becomes more difficult
Solution Approach 1:
A heat spreader is introduced as an intermediary thermal management component between the bottom-side voltage regulator and the cooling system. The heat spreader collects heat from the voltage regulator and distributes it across a larger area, facilitating more efficient heat transfer to the motherboard and ultimately to the cooling solution, thus enabling effective cooling of bottom-mounted components.
Solution Approach 2:
The cooling system utilizes fluid-based thermal management (liquid cooling or pumped fluid circulation) to efficiently remove heat from the bottom-side voltage regulator. The fluid circulation system provides superior heat transfer capabilities compared to air cooling, enabling effective temperature control of components placed on the bottom of the motherboard.
3Device complexity
If traditional air cooling is used from fans on top of the server system, then the cooling system is simple, but the heat dissipation efficiency is insufficient for bottom-side component cooling
Solution Approach 1:
The system transitions from air-based convection cooling to liquid-based hydraulic cooling to achieve superior heat dissipation efficiency. The liquid cooling system provides higher thermal conductivity and heat capacity, enabling effective removal of heat from bottom-side components while maintaining system-level energy efficiency despite increased complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces power loss, lowers the total cost of ownership, and allows for a lower DC current path resistance between the voltage regulator and the processor, while maintaining the components below critical temperature thresholds.
Implementation Method 1
at least one heat pipe having an evaporator end adjacent the at least one electronic component, the heat pipe extending away from the evaporator end and along the bottom of the printed circuit board to a condenser end above the top of the printed circuit board, the condenser end being thermally coupled to the passive heat exchanger on the top of the printed circuit board
Implementation Method 2
the condenser end being thermally coupled to the passive heat exchanger on the top of the printed circuit board; wherein heat from electronic component is moved away from the electronic component and the integrated circuit component to the passive heat exchanger
Implementation Method 3
passive heat exchanger on the top of the printed circuit board
Implementation Method 4
passive heat exchanger on the top of the printed circuit board
Data Source
AI summary
Technology is disclosed for a computing system with a printed circuit board having a top and bottom; an integrated circuit component coupled to the top of the board; a passive heat exchanger coupled to the top of the board and spaced from the integrated circuit component; at least one electronic component coupled to the printed circuit board below the top of the printed circuit board; and at least one heat pipe having an evaporator end adjacent the electronic component and extending away from the evaporator end along the bottom of the board to a condenser end above the top of the board, the condenser end being thermally coupled to the passive heat exchanger on the top of the board; wherein heat from electronic component is moved away from the electronic component and the integrated circuit component to the passive heat exchanger.