PCB-Merged Cooling Channel for Electronic Component Thermal Management
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Solution Overview
Problem
Existing cooling methods for electronic components on PCBs require additional cooling elements and space, which can be inefficient and may not effectively distribute air flow for optimal cooling.
Innovation Solution
The method involves forming a channel using the sides of PCBs to direct air flow for cooling, where the PCBs and a channel forming element work together to create a cooling pathway without additional elements, allowing for tailored air flow and component positioning for enhanced cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If additional cooling elements are used to cool electronic components, then cooling effectiveness is improved, but device complexity and space requirements increase
Solution Approach 1:
The patent merges the PCB structure with the cooling channel structure. The PCB's first side is used to form part of the cooling channel, eliminating the need for separate cooling elements. This integration directly reduces device complexity while maintaining cooling effectiveness through the unified structure.
Solution Approach 2:
The PCB serves dual functions: as the electrical circuit board and as a structural component forming the cooling channel. This multi-functionality eliminates the need for additional dedicated cooling elements, reducing overall device complexity while preserving cooling capability.
2Temperature
If additional cooling elements are positioned in the assembly, then cooling capacity is improved, but the available space for other components is reduced
Solution Approach 1:
The cooling channel is merged with the PCB structure itself. The first side of the PCB forms the channel walls, eliminating the need for separate cooling elements that would occupy additional space. This allows the same cooling capacity with reduced space requirements.
Solution Approach 2:
The cooling channel is formed by utilizing the vertical thickness of the PCB and the spacing between stacked PCBs, rather than adding horizontal cooling elements. This three-dimensional utilization of space allows effective cooling without increasing the horizontal footprint of the assembly.
3Productivity
If cooling air is forced through a channel, then cooling efficiency is improved, but air flow distribution uniformity may worsen
Solution Approach 1:
Heatsink elements are strategically positioned at specific locations within the channel where components generate the most heat. This localized approach ensures that air flow is directed precisely where needed, maintaining uniform cooling effectiveness across different regions despite the forced air flow mechanism.
Solution Approach 2:
The channel cross-section is designed with curved surfaces rather than sharp angles, which promotes more uniform air flow distribution. The curved geometry reduces turbulence and dead zones, ensuring consistent cooling across the channel while maintaining forced air flow efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach saves space, provides direct cooling to components, and uses the channel forming element to stiffen the assembly while ensuring effective air flow distribution, optimizing cooling performance without additional cooling elements.
Implementation Method 1
The biasing elements comprise resilient elements which are biased against the air forcing element so as to exert a biasing force there on
Implementation Method 2
a thermally conducting material between such lower components and the lower surface
Implementation Method 3
an air forcing element which is positioned closer to the first end of the channel than the second end of the channel and is forcing air from outside the assembly through the air forcing element and into the channel
Data Source
AI summary
A printed circuit board having an electronic component which is to be cooled by a cooling surface biased thereon, where the biasing elements are abutted not by the PCB but a stiffer element attached to the PCB in order to not strain or bend the PCB.