Thermo-Conductive Coating for PCB Heat Dissipation
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Solution Overview
Problem
Conventional solder-resist coatings on circuit boards in backlight modules for LCDs impede thermo-conduction, leading to poor heat dissipation and degradation of light uniformity, affecting the overall quality of the display.
Innovation Solution
A thermo-conductive and electro-insulating coating is applied on the circuit board assembly to replace the conventional solder-resist coating, facilitating heat dissipation from the laminate to the bezel through the second surface, while maintaining electro-insulation and preventing solder tin from adhering to unwanted areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional solder-resist coating is applied on the circuit board, then electro-insulation is provided and soldering is controlled, but heat dissipation is impeded
Solution Approach 1:
The patent applies a composite coating structure consisting of a solder-resist layer and a heat-dissipating layer. The solder-resist layer provides electro-insulation and soldering control, while the heat-dissipating layer (made of thermally conductive material) conducts heat from the LED through the circuit board to the heat sink. This composite structure resolves the contradiction by combining materials with different functional properties in a single integrated coating system.
2Temperature
If a thermo-conductive material is applied on the bottom surface of the PCB, then heat dissipation is improved, but the retarding impact of solder-resist on thermo-conduction increases
Solution Approach 1:
The patent merges the solder-resist function and heat-dissipating function into a single integrated coating structure. Instead of treating these as separate issues requiring separate solutions, the invention combines them into one coating system where the solder-resist layer and heat-dissipating layer work together, reducing the overall complexity of the coating structure while achieving both electro-insulation and improved thermo-conduction.
3Ease of manufacture
If conventional solder-resist is used, then soldering control is achieved, but light uniformity deteriorates due to poor heat dissipation
Solution Approach 1:
The composite coating structure maintains the soldering control benefits of conventional solder-resist while adding heat-dissipating functionality. This resolves the contradiction by ensuring that the solder-resist layer continues to provide manufacturing ease and soldering control, while the integrated heat-dissipating layer improves thermal management to maintain light uniformity across the LCD display.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation efficiency, improves light source performance, and protects the board against contamination and short-circuits during soldering, thereby improving the overall quality of the backlight module.
Implementation Method 1
Both thermo-conductive and electro-insulating, the coating is adapted to outwardly dissipate heat from the laminate through the second surface
Implementation Method 2
Both thermo-conductive and electro-insulating, the coating is adapted to outwardly dissipate heat from the laminate through the second surface
Data Source
AI summary
A circuit board assembly and a backlight module comprising the circuit board assembly are provided. The circuit board assembly has a first surface and a second surface opposite to the first surface, and further comprises at least one laminate, a first conductive wiring structure and a coating. The first conductive wiring structure is formed on the first surface. The coating is formed on the coating area of the second surface, wherein the coating can conduct heat and provide electric insulation. Thus, the circuit board assembly is adapted to outwardly conduct heat from the laminate through the second surface and to promote the heat dissipation efficiency of the circuit board assembly.