PCB Cooling Layout Using Refrigerant and Airflow in Control Boxes

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Solution Overview

Problem

Air conditioners face inefficiencies in cooling printed circuit boards (PCBs) when external air blown by the fan and motor assembly has a high temperature, leading to inadequate heat dissipation.

Innovation Solution

An air conditioner design featuring a control box with a PCB that forms an air circulation passage, a cooling module for heat exchange with refrigerant, and a circulating fan to direct cooled air to high and low heat generation components, utilizing both refrigerant cooling and air cooling methods to efficiently dissipate heat.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If external air is used for cooling the PCB, then the cooling system is simple, but the cooling efficiency deteriorates when external air temperature is high

Engineering Contradiction:
Improvecooling system complexityVSAvoidPCB cooling efficiency
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The cooling system is segmented into two independent paths: one for high-heat components using refrigerant cooling, and another for low-heat components using air cooling. This segmentation allows each path to be optimized for its specific cooling requirements, resolving the contradiction between system simplicity and cooling efficiency.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different cooling methods are applied to different regions of the PCB based on local heat generation characteristics. High-heat components receive refrigerant cooling while low-heat components receive air cooling, optimizing overall cooling efficiency without unnecessarily complicating the entire system.

Inventive Principle:
Principle #3Local quality

2Temperature

If refrigerant cooling is applied to all components, then cooling efficiency is high, but device complexity and power consumption increase

Engineering Contradiction:
Improvecooling efficiencyVSAvoidcooling system complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

Refrigerant cooling is applied only to high-heat generating components on the PCB rather than uniformly to all components. This localized approach maintains high cooling efficiency where needed while reducing overall system complexity and power consumption.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

Instead of applying full refrigerant cooling system to all components, only the necessary partial cooling is provided to high-heat components, avoiding excessive complexity and energy consumption while maintaining adequate cooling where required.

Inventive Principle:
Principle #16Partial or excessive action

3Stability of the object's composition

If uniform cooling is applied to all PCB components, then thermal balance is improved, but energy consumption increases

Engineering Contradiction:
Improvethermal balanceVSAvoidpower consumption
Core Design Contradiction:
Stability of the object's compositionVSUse of energy by moving object

Solution Approach 1:

The cooling system provides differentiated cooling based on local heat generation characteristics of different PCB components. High-heat components receive intensive refrigerant cooling while low-heat components receive milder air cooling, achieving thermal balance without unnecessary energy consumption.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The cooling intensity and method are changed based on the thermal characteristics of different components. By adjusting cooling parameters (refrigerant flow to high-heat areas, air flow to low-heat areas), thermal balance is achieved while optimizing energy consumption.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables quick and uniform cooling of the PCB and control box interior, minimizing power consumption loss by using refrigerant cooling for high heat components and air cooling for low heat components, regardless of external temperature.

Implementation Method 1

a cooling module for making a first electric component of the plurality of electric components to heat exchange with refrigerant

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Implementation Method 2

a circulating fan arranged in the air circulation passage to make air to flow to a second electric component of the plurality of electric components after cooled by the cooling module

Methodology Applied
Scientific EffectForced convection: Forced Convection

Implementation Method 3

a heat absorbing plate in contact with the heat transfer plate for heat exchange with the air in the air circulation passage

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10021809B2Air conditioner
Publication Date: 2018.07.10 LG ELECTRONICS INC
  • US10021809B2 patent drawing
  • US10021809B2 patent drawing
  • US10021809B2 patent drawing

AI summary

Disclosed in an air conditioner including a control box having a space formed therein, a PCB arranged to form an air circulation passage in the space, the PCB having a plurality of electric components mounted thereto, a cooling module for making a first electric component of the plurality of electric components to heat exchange with refrigerant, and a circulating fan arranged in the air circulation passage to make air to flow to a second electric component of the plurality of electric components after cooled by the cooling module, thereby dissipating heat from an inside of the control box with a mixed cooling system of a refrigerant cooling system and an air cooling system, efficiently.