PCB Cooling via Cryogenic Compressor Housing
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Solution Overview
Problem
Current methods for increasing the current-carrying capacity of conductor tracks on circuit boards, such as thick-copper technology and busbars, result in high production costs and limitations in resolution due to self-heating issues, which can lead to delamination and destruction of the circuit board.
Innovation Solution
Active cooling of the circuit board using a refrigeration unit, specifically connecting it to a cryogenic device like an electric refrigerant compressor to extract heat and reduce the cross-sections of conductor tracks, thereby minimizing self-heating and preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thick-copper technology or busbars are used to increase current-carrying capacity, then the current load capacity is improved, but production costs and material usage increase significantly
Solution Approach 1:
The patent changes the thermal parameter of the system by introducing active cooling, which allows standard-thickness copper traces to carry high currents without overheating. The cooling system maintains the trace temperature below critical thresholds, enabling reduced copper cross-sections while preserving current-carrying capacity.
Solution Approach 2:
The patent introduces a cooling medium (liquid or gas) as an intermediary between the conductor tracks and the environment. This intermediary actively removes heat from the conductor tracks, allowing standard copper traces to dissipate heat more efficiently and carry higher currents without requiring increased copper cross-sections.
2Reliability
If thick copper layers are used to improve current-carrying capacity, then the current load is increased, but conductor gap resolution and manufacturing precision are limited
Solution Approach 1:
The patent changes the thermal management parameter by implementing active cooling, which allows thin copper traces with fine conductor gaps to maintain acceptable temperature levels under high current loads. This enables high manufacturing precision in PCB fabrication while preserving current-carrying capacity through thermal control rather than increased material cross-sections.
3Reliability
If broad and thick copper conductor tracks are used, then current-carrying capacity is improved, but production costs and manufacturing complexity increase
Solution Approach 1:
The patent changes the thermal parameter by introducing active cooling systems, which enable the use of standard-thickness copper traces for high-current applications. This approach reduces material costs and simplifies manufacturing processes while maintaining the required current-carrying capacity through controlled heat dissipation.
4Ease of manufacture
If standard copper traces are used without cooling, then production costs are reduced, but self-heating causes delamination and circuit board destruction
Solution Approach 1:
The patent introduces a cooling medium as an intermediary that actively removes heat from the conductor tracks. This intermediary prevents thermal runaway and delamination by maintaining the conductor temperature within safe operating limits, enabling the use of cost-effective standard copper traces in high-current applications.
Solution Approach 2:
The patent converts the harmful effect of heat generation into a beneficial thermal management system. By implementing active cooling, the heat that would otherwise cause delamination is utilized to drive the cooling system, which then prevents thermal damage and extends the operational life of the circuit board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the current-carrying capacity of conductor tracks while reducing material and production costs, preventing thermal-induced detachment, and allowing for smaller conductor cross-sections without compromising current load, thus improving the reliability and efficiency of circuit boards.
Implementation Method 1
the circuit board is connected with this compressor housing in an adequately thermally conductive way
Implementation Method 2
the refrigerant compressor is self-cooling as a result of the refrigerant contained therein... heat from objects, such as a printed circuit board, can be extracted
Implementation Method 3
The main reason for the conductor cross-sections mentioned in the IPC2221 Directive is the self-heating of the conductor tracks caused by ohmic resistance
Data Source
AI summary
An assembly and a method for maximizing the current-carrying capacity of conductor tracks and the current-carrying capacity of conductors on or within a circuit board, allows for the use of copper materials, and minimizes the costs of materials and production of the circuit board. The circuit board is connected via a housing with a coolant of a cryogenic device in order to provide heat extraction. The extraction of heat from the circuit board occurs by connecting the circuit board via a housing with a coolant of a cryogenic device.