Power Circuit Board Cooling Layout With Insulated Sidewall Heat Transfer
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Solution Overview
Problem
Existing electrical devices face challenges in achieving structural compactness, ease of assembly, and efficient heat dissipation without causing coolant pressure drops, due to the use of plastic members and complex screw fixation, which also complicates the design of coolant channels.
Innovation Solution
An electrical device design featuring a heat-dissipating member with an adjacent cooling circuit, an insulating and heat-dissipating element between the side wall and power circuit board, and a power circuit board with heat-generating elements, allowing direct heat conduction to the cooling circuit while ensuring insulation, omitting plastic members and simplifying assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuit board is mounted in a horizontal orientation above the heat sink with a plastic member for support, then the circuit board is supported and insulated, but space is wasted and structural compactness is difficult to achieve
Solution Approach 1:
The patent merges the support function and insulation function into the heat sink structure itself. The heat sink includes a support portion that directly supports the circuit board, and the insulating portion is integrated into the heat sink body, eliminating the need for a separate plastic member. This integration achieves both support and insulation while maintaining structural compactness.
Solution Approach 2:
The patent extracts the plastic member from the system by providing alternative support and insulation functions through the heat sink's own structure. The support portion and insulating portion of the heat sink take over the functions previously performed by the separate plastic member, eliminating unnecessary components and reducing overall volume.
2Reliability
If multiple screws are used to fix the circuit board in place, then the circuit board is securely mounted, but assembly becomes more complicated and stress on the circuit board increases
Solution Approach 1:
The patent combines the fixation function with the support portion of the heat sink. The support portion is designed to directly hold the circuit board without requiring separate screw fixtures, thereby securing the circuit board while simplifying the assembly process and reducing the number of fastening components needed.
3Temperature
If turbulators are provided in the coolant channels to increase heat dissipation efficiency, then heat dissipation is improved, but a pressure drop occurs in the coolant
Solution Approach 1:
The patent removes the turbulator structures from the coolant channels. Instead of adding complexity with ribs and turbulators, the design uses a simplified smooth channel structure that maintains adequate heat dissipation without causing unwanted pressure drops in the coolant flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves structural compactness, simplifies assembly, enhances heat dissipation efficiency, and prevents coolant pressure drops by eliminating the need for turbulators, thus improving cost-effectiveness and performance.
Implementation Method 1
the heat of the heat-generating element to be promptly and effectively conducted to the cooling circuit (which is disposed adjacent to the adjacent part) of the heat-dissipating member via the insulating and heat-dissipating element
Implementation Method 2
a cooling circuit for circulating a cooling medium, the cooling circuit being disposed in the main body and adjacent to the adjacent part of the side wall
Data Source
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AI summary
The present disclosure discloses an electrical device (10) which comprises a heat-dissipating member (100) providing a main body with a top surface (120) and a side wall (130) extending in an extension direction transverse to the top surface (120). The heat-dissipating member further comprises a cooling circuit (140) for circulating a cooling medium, and is disposed in the main body (110) and adjacent to the adjacent part (131) of the side wall (130). The electrical device (10) further comprises a power circuit board assembly (200) with a power circuit board (200a) and a heat-generating element (230) disposed on the power circuit board (200a). The electrical device (10) further comprises an insulating and heat-dissipating element (300), disposed between the adjacent part (131) of the side wall (130) and the first surface (210) of the power circuit board (200a), wherein the heat-generating element (230) is disposed on the first surface (210).