PCB Cooling Module With Segregated Ullage Air Chamber
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Solution Overview
Problem
Existing liquid cooling systems for electronic components face challenges in containing costly coolant while minimizing the volume of ullage air to prevent pressure increases and ensure effective cooling, particularly when components generate substantial heat.
Innovation Solution
A cooling module with a casing that separates ullage air from electronic components using a chamber and channels, allowing for optimal coolant immersion and expansion, combined with projections for enhanced heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the casing is filled with liquid coolant to immerse electronic components, then cooling effectiveness is improved, but volume for ullage air expansion is reduced
Solution Approach 1:
The casing internal volume is segmented into two distinct regions: a first internal volume for mounting the printed circuit board with electronic components, and a second internal volume for accommodating ullage air. These volumes are separated by internal partitions or structural design, allowing the liquid coolant to fill the first volume for effective component immersion cooling while preserving the second volume for ullage air expansion during thermal cycles.
2Stress or pressure
If ullage air volume is increased to mitigate pressure increases, then pressure management is improved, but coolant immersion effectiveness is reduced
Solution Approach 1:
The internal volume is divided into separate compartments: the first internal volume contains the electronic components and is filled with liquid coolant for optimal thermal contact, while the second internal volume is reserved for ullage air. This segmentation ensures that the coolant can fully immerse the components in the first volume without being displaced by ullage air, while still providing sufficient expansion space in the second volume for pressure management.
Solution Approach 2:
Internal partitions or structural elements act as intermediaries between the coolant-filled region and the ullage air region. These partitions prevent direct mixing of coolant and ullage air while allowing thermal energy to be managed effectively. The partitions ensure that ullage air remains in the second volume where it can expand and contract without interfering with the coolant's ability to cool components in the first volume.
3Quantity of substance
If coolant volume is minimized to reduce cost, then economic efficiency is improved, but cooling capacity is reduced
Solution Approach 1:
By segmenting the internal volume into a dedicated first volume for components and coolant, and a separate second volume for ullage air, the system minimizes the total coolant volume required. The coolant only needs to fill the first internal volume sufficient to immerse the electronic components, rather than filling the entire casing volume. This reduces coolant quantity and cost while maintaining adequate cooling capacity for the components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively cools electronic components by maintaining coolant immersion and managing ullage air, ensuring efficient heat dissipation and minimizing coolant volume, thus preventing pressure buildup and optimizing thermal performance.
Implementation Method 1
The coolant may be thermally conductive... immersion of the electronic components in a fluid (liquid and/or gas) that carries heat away from the electronic components
Implementation Method 2
the coolant may have advantageous convective properties
Implementation Method 3
Both the liquid coolant and the ullage air may expand through being heated by the electronic components; however, the ullage air may be more compressible than the liquid coolant, and therefore the ullage air may act to mitigate pressure increases in the system
Implementation Method 4
Projections (50) may be provided on the casing (2), and may significantly increase the transfer of heat from the casing (2) to ambient air
Data Source
AI summary
A cooling module for a printed circuit board having one or more heat generating components. The cooling module comprises a casing defining a first internal volume adapted for mounting a printed circuit board therein, the casing comprising a first internal major surface and a second internal major surface. The cooling module further comprises a chamber defining a second internal volume in fluid communication with the first internal volume. The first and/or second internal major surface comprises a first cavity. The first and/or second internal major surface further comprises a first channel connecting the first cavity to the second internal volume.