PCB Copper Foil Dust Suppression via Protective Coating
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Solution Overview
Problem
The existing electronic apparatuses using screws for securing printed circuit boards face issues with dust generation due to solder connections and copper oxide, which can lead to malfunction and environmental concerns from gold plating processes.
Innovation Solution
An electronic apparatus design featuring a fixing member with a shaft and head portion, where copper foil is covered by a polyimide cover film with an opening for exposure, and a conductive material like soldering material is used to seal the copper foil, preventing dust scattering and eliminating the need for gold plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder connection and copper foil are plated with gold to suppress dust generation, then reliability is improved, but manufacturing cost increases and environmental impact worsens
Solution Approach 1:
The patent replaces expensive gold plating with a disposable protective coating applied to the solder connection and copper foil. This coating is designed to be thin and inexpensive, providing sufficient protection against dust generation without requiring the costly gold plating process, thereby reducing both manufacturing cost and environmental impact while maintaining dust suppression functionality
Solution Approach 2:
The patent employs a composite protective coating structure consisting of multiple layers (including organic protective coatings and inorganic protective coatings) applied over the solder and copper foil. This composite structure provides effective dust suppression and protection against oxidation without requiring gold plating, achieving the same reliability benefits at lower cost and environmental impact
2Reliability
If copper foil is exposed for electrical connection, then electrical conductivity is improved, but dust generation increases due to oxidation
Solution Approach 1:
The patent applies protective coatings selectively to specific areas of the copper foil and solder connection. The coating is applied locally at the connection points where electrical contact is needed, allowing electrical conductivity to be maintained at those specific locations while protecting surrounding exposed copper surfaces from oxidation and dust generation
Solution Approach 2:
The patent uses thin film protective coatings that conform to the surface geometry of the solder and copper foil. These flexible thin films provide continuous protection against oxidation and dust generation while allowing the underlying electrical connection structures to function properly, maintaining electrical conductivity without exposing copper to oxidative environments
Data Source
AI summary
According to one embodiment, an electronic apparatus includes a case, a printed circuit board contained in the case and having a through-hole, and a fixing member including a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion. The electronic apparatus also includes copper foil provided on the printed circuit board, and a cover film including an opening portion configured to expose part of the copper foil. The opening portion is located at a position which is to be covered with the head portion, and the cover film covers the copper foil at positions other than the position where the opening portion is located. The electronic apparatus further includes a conductive material provided on the copper foil inside the opening portion and configured to electrically connect the head portion and the copper foil to each other.