PCB Inner Copper Layers for Thermal Dissipation
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Solution Overview
Problem
Compact designs and high packing density in integrated electronic components hinder effective heat dissipation from power components, as traditional cooling methods like metallic heat conduction through printed circuit boards are inefficient and restrict component placement.
Innovation Solution
Incorporating inner layers made of thermally conductive materials, such as solid copper, with structured contact openings and a clamping edge for heat dissipation, allowing power components to be placed on both sides of the printed circuit board and enhancing thermal conductivity while minimizing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional metallic heat conduction through printed circuit board is used, then heat dissipation structure is simple, but heat dissipation efficiency is insufficient and component placement is restricted
Solution Approach 1:
The patent employs a composite heat conduction structure combining copper inner layers within the PCB and a separate cooling plate made of thermally conductive material. This multi-material approach enhances heat dissipation efficiency by leveraging the high thermal conductivity of copper and the heat sink capabilities of the cooling plate, while maintaining structural integration.
Solution Approach 2:
The patent transitions from traditional two-dimensional surface mounting to three-dimensional heat conduction pathways by incorporating internal copper layers and vertical cooling channels. This dimensional expansion allows heat to be conducted through multiple layers and directions, significantly improving heat dissipation efficiency without increasing the device's external footprint.
2Volume of moving object
If compact design with high packing density is implemented, then device size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent utilizes the third dimension (vertical direction) for heat conduction by implementing internal copper layers and cooling channels that extend through the PCB thickness. This allows efficient heat dissipation within a compact horizontal footprint, enabling high packing density while maintaining effective thermal management.
Solution Approach 2:
The heat conduction path is segmented into multiple functional zones: power component mounting areas, copper inner layer heat collection zones, thermal via regions, and cooling plate contact areas. This segmentation allows optimized heat dissipation in each zone while maintaining overall compact device dimensions.
3Loss of energy
If thermally conductive medium is applied between printed circuit board and housing, then thermal transfer resistance is minimized, but component placement on underside is prevented
Solution Approach 1:
The patent moves the primary heat conduction function from the horizontal interface (requiring thermal medium) to the vertical dimension through internal copper layers and through-board cooling channels. This eliminates the need for thermal medium application on the underside while maintaining low thermal resistance, thereby restoring placement flexibility.
Solution Approach 2:
The patent extracts the thermal medium requirement from the design by implementing self-contained internal heat conduction pathways. The copper inner layers and cooling plate create direct thermal coupling without requiring external thermal paste or adhesive, freeing the underside for component placement.
4Loss of energy
If thermal vias are used to improve heat flow through printed circuit board, then heat conduction is enhanced, but layout flexibility is limited
Solution Approach 1:
The patent combines traditional thermal via technology with extensive copper inner layers to create a hybrid heat conduction system. The copper layers provide broad heat collection areas that feed into thermal vias, distributing heat more evenly and reducing the need for dense via patterns, thereby simplifying layout constraints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat dissipation, reduces thermal transfer resistance, and allows for a more compact design with increased usable printed circuit board area, accommodating power components on both sides and improving layout flexibility.
Implementation Method 1
a circuit board (10), in particular a multi-layer circuit board (10), with at least one inner layer (12) made of a thermally conductive material for dissipating heat from the power components (11)
Implementation Method 2
The power components (11) can be thermally coupled to the inner layer (12) via at least one contact opening (13) arranged transversely to the printed circuit board (10)
Implementation Method 3
A clamping edge (16) is preferably formed for thermal dissipation from the inner layer (12) into the housing
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The component has a printed circuit board (10) e.g. multilayer printed circuit board, and electronic power components (11) that are arranged on the board. A housing is provided for partially surrounding the board. The board has an inner layer (12), which is made of a heat conducting material e.g. solid copper. The power components are thermally connectable with the inner layer by a contact opening (13), which is arranged transverse to the board and designed as a drill hole. A clamping edge (16) is designed for thermally dissipating the heat from the inner layer. An independent claim is also included for a cooling device for an integrated electronic component.