PCB Core Layer Dielectric Design for 5G Signal Loss Reduction
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Solution Overview
Problem
Existing materials and structures struggle to efficiently transmit high-frequency signals above 10 GHz in the 5G era without significant loss, necessitating the development of new materials and structures for printed circuit boards and packages.
Innovation Solution
A printed circuit board and package design featuring a laminate with a core layer and insulating layers, where the core layer has a higher dielectric constant and lower dielectric dissipation factor than the insulating layers, and includes multiple antennas and a flexible insulating layer with thermoplastic and thermosetting resin layers, optimized for signal transmission with reduced rigidity and signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If existing materials and structures are used for signal transmission in 5G frequency band (10 GHz or more), then the structure is simple and easy to manufacture, but signal transmission loss increases significantly
Solution Approach 1:
The patent employs a composite laminate structure comprising a core layer with high dielectric constant and low dielectric dissipation factor, insulating layers with lower dielectric constant, and flexible insulating layers. This composite material approach enables effective signal transmission at 10 GHz and above by combining materials with complementary properties to reduce overall signal loss while maintaining manufacturability through standardized layering processes.
Solution Approach 2:
The patent optimizes signal transmission by carefully selecting and controlling key parameters: the core layer has a dielectric constant of 3.0 or more with a dielectric dissipation factor of 0.004 or less, while insulating layers have a dielectric constant of 2.5 or less. The thickness of the core layer is set to 0.5 mm or more, and the total thickness of insulating layers is controlled to 0.2 mm or less. These parameter specifications directly reduce signal transmission loss at 5G frequencies.
2Loss of energy
If the core layer has higher dielectric constant and lower dielectric dissipation factor to reduce signal loss, then signal transmission efficiency improves, but the rigidity of the core layer increases
Solution Approach 1:
The patent applies local quality by using a flexible insulating layer specifically positioned between the core layer and the outer environment. This flexible layer compensates for the increased rigidity of the high-performance core layer, allowing the core to maintain its superior dielectric properties (high dielectric constant, low dielectric dissipation factor) for signal loss reduction, while the flexible insulating layer provides the necessary flexibility and stress relief locally.
3Reliability
If multiple antennas are formed on the laminate to improve signal processing and connectivity, then communication performance improves, but the device complexity increases
Solution Approach 1:
The patent implements multi-functionality by designing the laminate structure to support multiple antennas (first antenna on the first surface, second antenna on the second surface, and additional antennas) that can operate across different frequency bands including 5G frequencies. The standardized laminate with controlled dielectric properties serves as a universal platform for various antenna configurations, improving communication performance and reliability without proportionally increasing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances signal transmission efficiency and reduces signal loss, enabling effective communication in the 5G frequency band by leveraging the higher dielectric constant and lower dissipation factor of the core layer, while the flexible insulating layers and multiple antennas improve signal processing and connectivity.
Implementation Method 1
A dielectric constant of the core layer is higher than a dielectric constant of the one of the insulating layers
Implementation Method 2
A dielectric dissipation factor of the core layer may be lower than a dielectric dissipation factor of the one of the insulating layers
Data Source
AI summary
A printed circuit board includes: a laminate including a core layer and insulating layers stacked on first and second sides of the core layer; and a first antenna formed on a surface of the laminate. A thickness of the core layer is greater than a thickness of one of the insulating layers. A dielectric constant of the core layer is higher than a dielectric constant of the one of the insulating layers.