PCB Core Laminate With Heat-Dissipating Layer for Wireless Charger Coils
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Solution Overview
Problem
Existing PCB-based coils for wireless power chargers face challenges in maintaining consistent current density and heat dissipation characteristics across inner and outer layers due to differences in heat dissipation, leading to irregular inductance and resistance, increased conduction loss, and decreased productivity.
Innovation Solution
A PCB core laminate with a multilayer structure that includes a heat-dissipating material layer interposed between PCB cores, using materials like ethylene-based resin, acrylic-based resin, and inorganic materials such as BN or Al2O3, to equalize heat dissipation characteristics and allow for the same track width across inner and outer circuit layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a multilayer PCB structure is used to increase current-carrying capacity, then the current-carrying cross-sectional area is improved, but the heat dissipation characteristics become uneven between inner and outer layers
Solution Approach 1:
The patent applies different track widths to inner and outer circuit layers based on their specific heat dissipation requirements. Outer layers have wider tracks for better heat dissipation, while inner layers have narrower tracks, creating local quality differences that optimize both current capacity and thermal management
Solution Approach 2:
The patent introduces a heat-dissipating material layer as an intermediary between PCB cores. This intermediate layer with high thermal conductivity facilitates heat transfer from inner circuit layers to outer layers, balancing heat dissipation characteristics across the multilayer structure
2Power
If inner and outer layers have different track widths to maintain current density, then current-carrying capacity is optimized, but manufacturing complexity increases
Solution Approach 1:
The patent implements different track widths for inner and outer layers as a localized design feature. This approach optimizes current density in each layer according to its specific thermal conditions while maintaining overall system functionality
Solution Approach 2:
The patent changes the geometric parameter (track width) of circuit patterns based on layer position. By adjusting this physical parameter, the design achieves optimal current density distribution while managing heat dissipation characteristics
3Loss of energy
If Litz wire is used to reduce resistance at high frequencies, then power transmission efficiency is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent replaces manual mechanical coil winding with automated PCB printing processes. Circuit patterns are directly printed on PCB substrates, eliminating the need for manual Litz wire winding and associated complexity
Solution Approach 2:
The patent changes the material form from physical wire (Litz wire) to printed conductive patterns. This parameter change enables automated manufacturing while achieving equivalent or superior electrical performance through precise pattern control
4Adaptability or versatility
If manual coil winding is used to achieve custom inductance, then design flexibility is improved, but productivity decreases
Solution Approach 1:
The patent replaces manual mechanical winding operations with automated PCB printing and stacking processes. Circuit patterns are printed directly on substrates and layers are stacked and bonded automatically, dramatically increasing productivity
Solution Approach 2:
The patent performs preliminary design of circuit patterns directly on PCB substrates before assembly. This preliminary action enables automated manufacturing while maintaining design flexibility through programmable pattern generation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures consistent heat dissipation and current density across all layers, reducing temperature rise and conduction loss, thereby improving efficiency and productivity of the wireless power charger.
Implementation Method 1
a heat-dissipating material layer is interposed between the first PCB core and the second PCB core
Data Source
AI summary
An embodiment printed circuit board (PCB) core laminate for a wireless power charger includes a PCB substrate including a first PCB core and a second PCB core stacked on the first PCB core, wherein printed circuit patterns are located on surfaces of the PCB substrate, and a heat-dissipating material layer interposed between the first PCB core and the second PCB core.