PCB Cover Layer Design for Conductor Protection and Heat Dissipation

Solution Overview

Problem

Conductive layers on printed circuit boards can be damaged when they overlap during handling, leading to potential functional deterioration and disconnection, which compromises the heat radiating properties and reliability of power supply devices.

Innovation Solution

A printed circuit board design featuring a conductive pattern with a surface-shaped exposure area thermally connected to a heat radiating member, covered by a layer on non-exposure areas to prevent damage during handling, while maintaining high heat radiating efficiency. The board is integrated into a housing where the exposed area is connected to the housing's bottom surface, acting as a heat radiating member, and additional dummy portions with cover layers are used to prevent contact between overlapping boards.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the conductive layer is exposed to improve heat radiating property, then heat radiating efficiency is improved, but the conductive layer may be damaged when printed circuit boards overlap during handling

Engineering Contradiction:

Improveheat radiating propertyVSAvoidconductive layer integrity

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent applies local quality by creating a selective exposure configuration where only specific portions of the conductive layer are exposed to improve heat radiating efficiency, while other portions remain covered for protection. The conductive pattern is partially exposed at the heat radiating surface and partially covered by the insulating layer, providing different functional properties in different locations of the same component.

Inventive Principle:

Principle #3Local quality

2Temperature

If the conductive layer is exposed to improve heat radiating property, then heat radiating efficiency is improved, but destruction or functional deterioration of the power supply device may occur

Engineering Contradiction:

Improveheat radiating propertyVSAvoiddamage to power supply device

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by creating a selective exposure configuration where only specific portions of the conductive layer are exposed to improve heat radiating efficiency, while other portions remain covered for protection. The conductive pattern is partially exposed at the heat radiating surface and partially covered by the insulating layer, providing different functional properties in different locations of the same component.

Inventive Principle:

Principle #3Local quality

3Reliability

If the cover layer covers the conductive pattern to prevent damage, then conductor protection is improved, but heat radiating property deteriorates

Engineering Contradiction:

Improveconductor protectionVSAvoidheat radiating property

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent applies local quality by creating a selective exposure configuration where only specific portions of the conductive layer are exposed to improve heat radiating efficiency, while other portions remain covered for protection. The conductive pattern is partially exposed at the heat radiating surface and partially covered by the insulating layer, providing different functional properties in different locations of the same component.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively maintains high heat radiating properties while preventing conductor damage during handling and assembly, ensuring the reliability and functionality of power supply devices by adjusting the size of the exposed conductive pattern and using cover layers to prevent contact between overlapping boards.

Implementation Method 1

a connection area thermally connected to a heat radiating member

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9788410B2Printed circuit board and power supply device

Publication Date: 2017.10.10 TDK CORP

AI summary

In the printed circuit board 100 in the power supply device, cover layers C1 and C2 are formed on a surface other than the connection areas 95A′ and 95B′ within a coil pattern EC, which corresponds to a surface-shaped exposure area exposed to the outside so that the size of the surface-shaped exposure area to which the conductive pattern E is exposed is adjusted, so that an effect, which restrains a conductor from being damaged, especially at a time of carrying the printed circuit board 100 while maintaining a heat radiating property of the conductor, is achieved.