PCB Cover Shield Structure for Uniform Display Panel Cooling
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Solution Overview
Problem
Display devices face challenges in efficiently cooling components on printed circuit boards, leading to temperature deviations on the front surface of the display panel, which can affect display quality and reliability.
Innovation Solution
A display device design that includes a cover shield with a forming unit protruding towards the printed circuit board to enhance heat dissipation, combined with a heat sink to intensively dissipate heat from high-temperature components, thereby reducing temperature deviations across the display panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If components are densely arranged on the printed circuit board to reduce device volume, then productivity and compactness are improved, but heat dissipation becomes insufficient leading to temperature deviations
Solution Approach 1:
The cover shield incorporates a forming unit with a specific protruding shape that creates localized heat dissipation channels directly above high-temperature components. This local structural modification enables targeted heat management without changing the overall device volume, allowing dense component arrangement while maintaining effective heat dissipation at critical locations.
Solution Approach 2:
The solution transitions from two-dimensional heat dissipation (surface level) to three-dimensional heat management by adding vertical heat dissipation channels through the forming unit. The protruding structure creates airflow paths in the vertical dimension, enabling heat to be dissipated upward and away from the panel while maintaining compact horizontal dimensions.
2Temperature
If a cover shield is added to improve heat dissipation, then temperature uniformity is improved, but device complexity increases
Solution Approach 1:
The cover shield integrates multiple functions into a single component: it serves as both a protective cover and a heat dissipation structure. The forming unit combines the shield body with integrated heat dissipation channels, eliminating the need for separate heat sinks or cooling components, thus improving temperature uniformity without proportionally increasing device complexity.
Solution Approach 2:
The cover shield is designed as a multi-functional component that simultaneously provides mechanical protection for internal components and active heat dissipation through its forming unit structure. This universal design approach allows one component to address both protection and thermal management needs, reducing the overall number of parts required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces temperature deviations on the display panel, improving display quality by uniformly dissipating heat and minimizing hotspots, which enhances the overall performance and reliability of the display device.
Implementation Method 1
heat transmitted to the display panel may be reduced by increasing a heat dissipation amount of a component which generates heat at a high temperature
Implementation Method 2
heat transmitted to the display panel may be reduced by increasing a heat dissipation amount of a component which generates heat at a high temperature
Data Source
AI summary
A display device may include a display panel configured to display an image, a printed circuit board disposed on one surface of the display panel, and a cover shield which covers the printed circuit board and includes a forming unit protruding toward the printed circuit board.