Printed Wiring Board Crosstalk Suppression via 3D Grounding
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Solution Overview
Problem
The existing printed wiring boards do not sufficiently suppress crosstalk between the first wire pattern and the second wire pattern.
Innovation Solution
The printed wiring board design includes a first insulating layer, first and second wire patterns, a first ground pattern, an adhesive layer, a second insulating layer, a third ground pattern, and conductor layers. Through-holes are formed in the insulating layers and ground patterns, with the conductor layers electrically connected to the ground patterns, effectively reducing crosstalk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a coplanar ground pattern is used between wire patterns, then crosstalk suppression is improved, but the ground pattern occupies valuable routing space and increases layer complexity
Solution Approach 1:
The invention transitions from a 2D coplanar ground pattern to a 3D vertical ground pattern system. Through-holes penetrate the insulating layer to connect ground patterns on opposite surfaces, creating a three-dimensional grounding structure that suppresses crosstalk without occupying lateral routing space, thus resolving the contradiction between crosstalk suppression and layer complexity.
Solution Approach 2:
Conductor layers are introduced as intermediaries within the through-holes to electrically connect the ground patterns on different surfaces. These conductor-filled through-holes act as vertical ground connections that mediate between the upper and lower ground patterns, providing effective crosstalk suppression while maintaining a cleaner layer structure compared to coplanar grounds.
2Object-affected harmful factors
If through-holes are formed to connect ground patterns vertically, then crosstalk suppression is improved, but manufacturing complexity increases
Solution Approach 1:
The insulating layer is designed with pre-defined through-hole regions that align with the ground patterns. This preliminary structuring of the insulating layer facilitates subsequent through-hole formation and conductor filling processes, making the manufacturing sequence more systematic and controllable despite the added complexity.
Solution Approach 2:
The conductor layer is nested within the through-holes, which themselves are nested within the insulating layer structure. This nested configuration allows the conductor to be precisely positioned and contained within the insulating material, simplifying the overall manufacturing process by providing clear structural boundaries for each component.
Data Source
AI summary
A printed wiring board includes: a first insulating layer having a first main surface and a second main surface opposite to the first main surface; a first wire pattern, a second wire pattern, and a first ground pattern that are disposed on the second main surface and extend along a first direction in a plan view; a second ground pattern disposed on the first main surface; an adhesive layer disposed on the second main surface so as to cover the first wire pattern, the second wire pattern, and the first ground pattern; a second insulating layer disposed on the adhesive layer and having a third main surface facing the adhesive layer and a fourth main surface opposite to the third main surface; a third ground pattern disposed on the fourth main surface; and a first conductor layer and a second conductor layer.