Perpendicular PCB Current Measurement Layout for Heat and Space Limits
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Solution Overview
Problem
Existing printed circuit boards used in residential, commercial, and industrial electrical equipment, particularly in electric vehicle charging and electricity meters, face space occupancy and overheating issues due to large measurement circuits, especially under high currents, which can damage surrounding components.
Innovation Solution
A printed circuit board design featuring a motherboard with a perpendicular daughterboard, where conductive traces extend across both faces, allowing measurement devices to be placed on the daughterboard, minimizing board space usage and improving heat dissipation, using braze connections for strong electrical continuity, and incorporating Hall effect sensors for non-contact current measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If measurement circuits based on toroidal cores are used on the printed circuit board, then measurement capability is achieved, but board space occupancy increases significantly
Solution Approach 1:
The patent transitions the measurement circuit from a planar configuration on the motherboard to a three-dimensional vertical structure using a daughterboard positioned perpendicular to the motherboard. This dimensional change allows the measurement circuit to occupy vertical space rather than horizontal board area, effectively resolving the space occupancy issue while maintaining measurement functionality.
Solution Approach 2:
The patent divides the circuit board system into two separate functional modules: the motherboard for general circuit functions and a daughterboard for measurement functions. This segmentation isolates the measurement circuit from the main board, reducing its impact on board space and allowing independent optimization of each module.
2Measurement precision
If measurement circuits are placed on the printed circuit board, then measurement capability is achieved, but overheating problems occur under high currents
Solution Approach 1:
The patent extracts the measurement circuit from the motherboard and places it on a separate daughterboard. This extraction removes the heat-generating measurement circuit from the main board environment, preventing thermal interference with surrounding components while maintaining measurement functionality.
Solution Approach 2:
The daughterboard acts as an intermediary structure between the motherboard and the measurement circuit. It provides thermal isolation while maintaining electrical connectivity through conductive links, serving as a thermal barrier that protects the motherboard from overheating.
3Measurement precision
If measurement circuits are integrated on the printed circuit board, then measurement capability is achieved, but surrounding components are damaged under high currents
Solution Approach 1:
The measurement circuit is extracted from the motherboard and relocated to a separate daughterboard. This physical separation eliminates the harmful thermal effects that would otherwise damage surrounding components on the main board, while the measurement functionality remains intact.
Solution Approach 2:
The system is segmented into distinct functional zones with the measurement circuit isolated on its own daughterboard. This segmentation creates a dedicated measurement zone that is thermally isolated from other components, preventing damage while maintaining measurement capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces board space requirements and minimizes heating, providing stable and efficient electrical measurements with reduced interference and improved safety, suitable for high-current applications.
Implementation Method 1
incorporating Hall effect sensors for non-contact current measurement
Implementation Method 2
a transition portion extending over both faces of the daughterboard, passing through it
Implementation Method 3
using braze connections for strong electrical continuity
Data Source
Figure 1~2
Figure 3~4
AI summary
The present invention relates to a printed circuit board device enabling the measurement of at least one electrical quantity, said device comprising a printed circuit board (1), referred to as motherboard (1), having a face, referred to as main face (1a), a measuring device enabling the measurement of at least one electrical quantity and the generation of measurement signals and at least one current-conducting track (3) for measurement.It is characterized in that it further comprises an additional printed circuit board, called daughterboard (2), having two opposite faces and being connected directly to the main face (1a) of the motherboard (1) by being held substantially perpendicular to the motherboard (1), in that the conductive track or each conductive track (3) comprises a main part (30, 30') extending over the main face (1a) of the motherboard (1) and a transition part extending over the two faces (20, 20') of the daughterboard (2) by passing through it, the main part (30, 30') comprising two main segments (30, 30') on either side of the daughterboard (2), each connected, by a conductive link (8), to the transition part of said conductive track (3) and in that the measuring device is implanted on the daughterboard (2) by being connected to the or one of the conductive transition parts.