PCB Heat Dissipation Pad That Redirects Current Flow
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Printed circuit boards generate heat due to resistive components, leading to potential malfunctions in sensitive components like microprocessors and FETs, and existing heat dissipation methods, such as separate heat sinks, are inefficient and limit the miniaturization of battery packs.
Innovation Solution
A high-conductance heat-dissipating pad with a comb structure and lead parts of higher electrical conductivity than the circuit board, which redirects current flow through the pad to reduce heat generation and efficiently dissipate heat, allowing for smaller battery pack designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a separate heat sink or cooler is used to dissipate heat, then heat dissipation capability is improved, but device complexity and size increase
Solution Approach 1:
The patent combines the heat dissipation function with the existing conductive pattern on the printed circuit board by forming a heat dissipation pad that integrates with the circuit board structure. This merging approach eliminates the need for separate heat sink components while maintaining effective heat dissipation capability.
Solution Approach 2:
The conductive pattern on the printed circuit board serves dual functions: electrical connection and heat dissipation. The heat dissipation pad structure allows the same conductive elements to perform both electrical and thermal functions, reducing overall device complexity.
2Temperature
If a separate heat dissipating plate is installed close to the FET, then heat generation problem is solved, but battery pack size cannot be reduced
Solution Approach 1:
The heat dissipation pad is integrated directly into the printed circuit board structure, merging the heat dissipation function with the existing board layout. This integration eliminates the need for additional space-consuming separate heat dissipating plates while maintaining effective heat control near the FET.
3Reliability
If current flows through conductive patterns with resistive components, then electrical connection is established, but heat is generated causing component malfunction
Solution Approach 1:
The patent applies different material properties to different regions of the conductive pattern. The heat dissipation pad uses materials with higher electrical and thermal conductivity compared to the standard conductive pattern, creating local quality differences that reduce heat generation in critical areas while maintaining electrical connection functionality.
Solution Approach 2:
The invention changes the electrical conductivity parameter of the conductive pattern by using materials with higher conductivity for the heat dissipation pad. This parameter change reduces resistive heating while maintaining the electrical connection function, thereby reducing harmful heat generation without compromising reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat-dissipating pad effectively reduces heat generation and dissipation on printed circuit boards, preventing component malfunctions and enabling the manufacture of smaller battery packs by efficiently redirecting and dissipating heat.
Implementation Method 1
the lead parts are formed of a material having an electrical conductivity greater than that of the conductive pattern of the printed circuit board, and the entire or a predetermined section of the lead parts is configured to directly contact the conductive pattern such that the greater part of the current normally flowing through the conductive pattern now flows through the lead parts
Implementation Method 2
a heat dissipating system comprising a heat-dissipating pad dissipating heat generated due to current flowing through the conductive pattern of the printed circuit board
Data Source
Figure 1~2
Figure 3
AI summary
The present invention presents a printed circuit board heat dissipation system using a highly conductive heat dissipation pad, the heat dissipation system comprising: one or more electronic components mounted on a printed circuit board; the printed circuit board having formed thereon a conductive pattern providing current paths between the mounted one or more electronic components; and a highly conductive heat dissipation pad discharging heat generated due to the current flowing in the conductive pattern of the printed circuit board.