Manufacturing Defect Attribution for PCB Assembly Maintenance

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Solution Overview

Problem

Manufacturing systems face challenges in identifying and addressing the root causes of production defects in complex manufacturing processes, such as PCB assembly, where defects are often attributed to multiple components and programming parameters without clear attribution, leading to inefficiencies in maintenance and quality control.

Innovation Solution

A method that receives factory information, associates defects with potential causes among factory components and programming parameters, and determines links between defects, components, and production elements, enabling automated blame attribution, sensitivity analysis, and maintenance recommendations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Difficulty of detecting and measuring

If automated defect detection is implemented in complex manufacturing processes, then defect detection capability is improved, but difficulty in identifying root causes increases due to multiple potential causes without clear attribution

Engineering Contradiction:
Improvedefect detection capabilityVSAvoidroot cause attribution information
Core Design Contradiction:
Difficulty of detecting and measuringVSLoss of information

Solution Approach 1:

The patent segments the defect analysis process into distinct components: defect detection, cause identification, and blame attribution. By breaking down the complex manufacturing system into individual components and processes, the system can track which specific component or process step is most likely responsible for each defect, preventing information loss about root causes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system implements feedback loops where defect information flows back through the manufacturing process steps to identify which step introduced the defect. This feedback mechanism maintains attribution information by continuously tracking which component or process is responsible for defects, enabling targeted maintenance and process improvement.

Inventive Principle:
Principle #23Feedback

2Measurement precision

If comprehensive defect tracking is performed across all manufacturing components, then defect attribution accuracy is improved, but system complexity and computational requirements increase

Engineering Contradiction:
Improvedefect attribution accuracyVSAvoidsystem complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent applies local quality by focusing computational resources on tracking and analyzing only the specific components and process steps most likely to cause defects. Rather than uniformly monitoring all components with equal detail, the system concentrates analysis on areas with higher defect probabilities, maintaining attribution accuracy while reducing overall system complexity.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The system dynamically adjusts tracking parameters based on defect patterns and component criticality. By changing which parameters are tracked and at what level of detail based on local conditions and defect history, the system achieves high attribution accuracy for critical components while reducing complexity for less critical areas.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS11598801B2Method for manufacturing system analysis and/or maintenance
Publication Date: 2023.03.07 ARCH SYSTEMS INC
  • US11598801B2 patent drawing
  • US11598801B2 patent drawing
  • US11598801B2 patent drawing

AI summary

A method for factory analysis and/or maintenance, preferably including receiving factory information and/or associating defects with factory components, and optionally including acting based on defect associations and/or operating factory machines. The method is preferably associated with one or more manufacturing systems and/or elements thereof.