Printed Circuit Board Deterioration Detection Wiring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing printed circuit board technologies face challenges in detecting deterioration, leading to increased manufacturing costs and complexity, as well as difficulties in replacing deterioration detection conductors without affecting the primary circuit functionality.
Innovation Solution
A printed circuit board design featuring a separate deterioration detection wiring board with a promotion pattern for faster deterioration, connected to the main board via a replacement-enabling connection part such as a solder joint, conductive adhesive, cable, or connector, allowing for easy exchange and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductor for deterioration detection is formed on the same printed circuit board as the primary circuit conductor, then deterioration can be detected early, but the yield rate declines and cost increases
Solution Approach 1:
The invention divides the printed circuit board into two separate boards: a main printed circuit board for primary circuit functionality and a deterioration detection wiring board for monitoring deterioration. This segmentation allows each board to be optimized independently, maintaining high yield rates for mass-produced main boards while providing reliable deterioration detection through the separate detection board.
2Reliability
If the solder resist is formed thinly in a specific area to create a deterioration detection conductor, then deterioration can be promoted and detected, but the manufacturing process becomes complicated
Solution Approach 1:
The invention separates the deterioration detection function onto a distinct wiring board, eliminating the need to complicate the solder resist formation process on the main circuit board. The detection board can use standard solder resist thickness while still achieving deterioration promotion through its design configuration.
Solution Approach 2:
The deterioration detection wiring board replicates the essential wiring pattern and connection structure of the main circuit board, allowing it to experience similar deterioration conditions without requiring complex modifications to the main board's manufacturing process.
3Reliability
If a conductor with narrower width or narrower insulation clearance is used for deterioration detection, then deterioration is promoted, but the yield rate in manufacturing declines
Solution Approach 1:
By creating a separate deterioration detection wiring board, the invention allows the detection conductor to have narrower width or clearance without affecting the manufacturing precision requirements of the main circuit board. The detection board can be designed with deliberately narrower features to promote deterioration while being manufactured separately with appropriate tolerances.
4Area of stationary object
If the deterioration detection conductor is formed on the same printed circuit board as the primary circuit, then space is utilized efficiently, but replacement of the deterioration detection conductor becomes difficult
Solution Approach 1:
The invention separates the deterioration detection wiring board from the main circuit board, enabling independent replacement of the detection board when deterioration is detected. This segmentation sacrifices some space efficiency but dramatically improves ease of repair, as the detection board can be replaced without affecting the primary circuit functionality.
Solution Approach 2:
The invention introduces connection parts that electrically connect the deterioration detection wiring board to the main circuit board while allowing physical separation. These connection parts serve as intermediaries that enable both electrical functionality and easy replacement by disconnecting at the connection points.
Data Source
AI summary
To provide a printed circuit board that allows for easy exchange of only a deterioration detection conductor, and can reduce costs. A printed circuit board includes: a main printed circuit board in which a wiring pattern is formed on an insulated substrate; and a deterioration detection wiring board in which deterioration detection wiring (deterioration detection wiring pattern) which is wiring having a form whereby deterioration is promoted compared to the wiring pattern on the insulated substrate is formed on a separate insulated substrate from the main printed circuit board, and is exchangeably connected to the main printed circuit board in a vicinity thereof by way of a replacement-enabling connection part. One mode of the replacement-enabling connection part of the printed circuit board is a connection part (solder joint) constituted by solder, another mode thereof is a connection part (electrically conductive adhesive connection part) constituted by electrically conductive adhesive, and yet another mode thereof is a connection part (cable) constituted by a cable.