Electromagnetic Probe for Non-Destructive PCB Dielectric Thickness Measurement
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Solution Overview
Problem
Existing methods for measuring the thickness of dielectric layers on circuit boards are destructive, time-consuming, and labor-intensive, leading to inefficiencies and board damage.
Innovation Solution
An electromagnetic measuring probe device with a probe-measuring unit, external conductive elements, magnetic powder groups, and a maintaining unit generates a magnetic field to attract and hold magnetic powder groups at specific positions on a circuit board, allowing for non-destructive measurement of dielectric layer thickness without damaging the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If destructive methods are used to measure dielectric layer thickness, then measurement can be performed, but the circuit board is damaged and must be scrapped
Solution Approach 1:
The patent replaces destructive mechanical measurement methods with non-destructive electromagnetic measurement. The measuring probe uses electromagnetic fields to detect dielectric layer thickness without physically damaging the circuit board, thereby eliminating the trade-off between measurement capability and board damage.
2Measurement precision
If traditional measurement methods are used, then thickness can be obtained, but the process is time-consuming and labor-intensive
Solution Approach 1:
The measuring probe automatically performs electromagnetic field detection and thickness calculation without requiring manual intervention for each measurement point. The system self-calibrates and processes measurements efficiently, eliminating labor-intensive operations while maintaining accurate thickness measurement.
3Loss of information
If multiple measurements are performed on different areas, then comprehensive data is obtained, but larger circuit board areas are destroyed
Solution Approach 1:
The electromagnetic measurement system allows multiple measurement points across different circuit board areas without destroying the board. The non-contact nature of electromagnetic field detection enables comprehensive data collection from multiple locations while preserving the entire board for continued use.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and non-destructive measurement of dielectric layer thickness, avoiding the costs associated with damaging circuit boards and improving operational efficiency.
Implementation Method 1
The conductive layers and the internal conductive pin generate the magnetic field
Implementation Method 2
The magnetic powder groups are attracted by the magnetic field and gathered to positions where correspond to thickness-range positions of the conductive layers
Data Source
AI summary
An electromagnetic measuring probe device for measuring a thickness of a dielectric layer of a circuit board and a method thereof are disclosed. The circuit board has at least one dielectric layer, at least two conductive layers and a test area. The test area has a test pattern and a through hole. The electromagnetic measuring probe device has a probe-measuring unit, an external conductive element, plural magnetic powder groups, and a maintaining unit. The probe-measuring unit has a transparent tube and an internal conductive pin. The external conductive element electrically connects with the test pattern. The conductive layers and the internal conductive pin generate a magnetic field while the probe-measuring unit enters into the through hole. The magnetic powder groups magnetically attracted are gathered to positions corresponding to thickness-range positions of the conductive layers and held by the maintaining unit, thus a gap between the two dielectric layers is obtained.