PCB Wafer-Level Component Embedding With Dummy Chip Thickness Matching
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Solution Overview
Problem
The increasing thickness of copper clad laminate in multi-layered printed circuit boards poses technical difficulties when embedding wafer level components, as the thickness difference between the laminate and the components leads to manufacturing challenges.
Innovation Solution
The method involves inserting a dummy chip to bridge the thickness difference by either integrating it during circuit board fabrication or wafer processing, using adhesive tapes and insulating layers to secure and align the wafer level components within cavities formed in the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the thickness of copper clad laminate is increased for multi-layered PCBs, then the structural strength and layer capacity are improved, but the manufacturing difficulty of embedding wafer level components increases due to significant thickness difference
Solution Approach 1:
A dummy chip is introduced as an intermediary component between the substrate and the wafer level component. The dummy chip has a thickness that compensates for the difference between the increased substrate thickness and the constant wafer level component thickness, enabling proper embedding without manufacturing difficulties
Solution Approach 2:
The thickness parameter of the dummy chip is specifically designed to match the difference between the substrate thickness and the wafer level component thickness. By changing the dummy chip thickness parameter, the system adapts to different substrate thicknesses while maintaining consistent wafer level component embedding
2Adaptability or versatility
If the thickness of copper clad laminate is increased, then the multi-layer capacity is improved, but the alignment precision of wafer level components deteriorates due to thickness mismatch
Solution Approach 1:
The dummy chip serves as a thickness intermediary that ensures the top surface of the wafer level component aligns properly with the substrate surface. This mediation maintains manufacturing precision despite variations in substrate thickness
Solution Approach 2:
The dummy chip is prepared and positioned in advance during the manufacturing process, before the final assembly. This preliminary action ensures that the thickness compensation is already in place, facilitating precise alignment of the wafer level component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the successful embedding of wafer level components without technical difficulties, even with thicker copper clad laminates, ensuring consistent manufacturing processes.
Implementation Method 1
attaching an adhesive tape to the lower surface of the substrate
Implementation Method 2
applying an adhesive-component material on top of the upper surface of the wafer level component
Data Source
AI summary
The present invention discloses a fabrication method of thick-walled printed circuit board PCB), especially the packaging substrate for mounting thin wafer level components on the PCB substrate. The present invention provides a first embodiment of inserting a dummy at the circuit board manufacturing stage and a second embodiment of adjusting the thickness by inserting a dummy at the wafer processing stage.