Multi-Layer PCB EBG Structure Using Penetration Vias
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Solution Overview
Problem
Existing circuit boards with EBG structures do not effectively suppress electromagnetic wave propagation across all layers due to leakage through clearance holes, as the EBG structure is only constructed between specific conductive layers, leaving other layers vulnerable to noise.
Innovation Solution
A multi-layered circuit board design incorporating at least three conductive layers with penetration vias and insulating openings, where the penetration via is connected to conductors in other layers, forming an EBG structure across all layers to prevent electromagnetic wave leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an EBG structure is constructed between conductive layers using clearance holes, then noise suppression between those layers is improved, but electromagnetic waves leak to other layers through the clearance holes causing noise countermeasure failure
Solution Approach 1:
The EBG structure is segmented into multiple independent units, each confined to specific conductive layers. By using penetration vias instead of clearance holes, each EBG unit is electrically isolated from other layers, preventing electromagnetic wave leakage while maintaining noise suppression effectiveness within the target layers.
Solution Approach 2:
Penetration vias serve as intermediaries that connect conductor patterns across multiple layers while being electrically isolated from conductor patterns in intermediate layers by insulating films. This mediator structure allows the EBG function to extend across all layers without causing electromagnetic wave leakage through clearance holes.
2Object-affected harmful factors
If penetration vias are used to construct EBG structure across multiple layers, then electromagnetic wave suppression across all layers is improved, but the manufacturing process complexity increases
Solution Approach 1:
The EBG structure manufacturing is merged with the standard multi-layer PCB manufacturing process. Penetration vias are formed simultaneously with other vias during the lamination process, and conductor patterns are formed using standard photolithography and etching processes, reducing overall manufacturing complexity despite the multi-layer EBG structure.
Solution Approach 2:
The penetration via structure serves multiple functions: it connects conductor patterns across layers for EBG formation, provides electrical isolation through insulating films, and can be integrated with existing PCB via structures. This multi-functionality reduces the need for separate manufacturing steps.
3Ease of manufacture
If conventional clearance holes are used in EBG structure, then the manufacturing process is simpler, but the EBG structure cannot effectively suppress noise in layers without EBG construction
Solution Approach 1:
The EBG structure is extended from a two-dimensional planar structure to a three-dimensional multi-layer structure by using penetration vias that extend through multiple conductive layers. This dimensional extension allows the EBG function to operate across all layers while maintaining manufacturing simplicity through integration with standard PCB processes.
Data Source
AI summary
A structure (10) includes at least three conductors (111, 131, 151) that are opposed to each other, a penetration via (101) that penetrates the conductors (111, 131, 151), openings (112, 152) that are formed so as to surround the penetration via (101), and conductor elements (121, 141) that are located in layers other than the layers in which the conductors (111, 131, 151) are located and that are connected to the penetration via (101). The conductor element (121) larger than the opening (112) is opposed to the opening (112) and the conductor element (141) larger than the opening (152) is opposed to the opening (152).