Multi-Layer PCB Edge Antenna for Millimeter-Wave Signal Transmission
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Solution Overview
Problem
The challenge in wireless communication technologies is to design compact antennas that can efficiently operate in high-frequency bands, such as those in the millimeter wavelength range, while minimizing signal losses due to cable connections and integrating multiple antennas in small communication devices like smartphones.
Innovation Solution
A multi-layer printed circuit board (PCB) is used to create a compact antenna design with conductive strips and vias forming a mesh pattern, allowing for capacitive feeding and efficient integration with radio front-end circuitry, enabling the transmission of radio signals across a wide frequency range from 10 GHz to 300 GHz.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If antenna size is reduced to match millimeter wavelength, then antenna can be integrated in small communication devices, but multiple antennas are needed to achieve sufficient performance
Solution Approach 1:
The patent transitions from planar 2D antenna structures to 3D multi-layer PCB structures. Multiple antenna elements are stacked vertically across different PCB layers, utilizing the third dimension (height) to pack more antenna elements into a compact footprint. This dimensional transition allows multiple antennas to coexist in a small volume while maintaining their individual performance characteristics.
Solution Approach 2:
The patent implements nested antenna structures where antenna elements on different PCB layers are vertically aligned and interconnected through vias. The antenna elements are nested within each other in the vertical dimension, with lower-layer antennas positioned beneath upper-layer antennas. This nesting approach maximizes spatial utilization and enables multiple antennas to occupy a compact form factor.
2Reliability
If cable connections are used for wired connections, then signal transmission is achieved, but losses increase towards higher frequencies
Solution Approach 1:
The patent extracts and eliminates the cable connection component from the signal transmission path. By integrating the antenna elements directly onto the PCB substrate and using PCB-trace feeding networks, the design removes the need for separate cable connections between the radio front-end circuitry and antenna elements. This extraction of the cable component directly reduces signal loss, especially at millimeter-wave frequencies where cable losses are significant.
Solution Approach 2:
The patent merges the antenna elements with the PCB substrate structure. The antenna elements are fabricated as conductive traces and patterns on the PCB layers themselves, combining the antenna function with the existing PCB infrastructure. This integration eliminates discrete cable connections and reduces the overall signal path, thereby minimizing losses at high frequencies.
3Adaptability or versatility
If multiple antennas are integrated in small communication devices, then bandwidth demands are met, but device complexity increases
Solution Approach 1:
The patent implements a universal multi-layer PCB platform that can support multiple antenna elements and different frequency bands. The same PCB structure and feeding network architecture can accommodate various antenna configurations and frequency ranges, providing a universal solution for meeting bandwidth demands across different 5G frequency bands without requiring separate dedicated structures for each antenna or frequency.
Solution Approach 2:
The patent segments the antenna system into multiple independent antenna elements distributed across different PCB layers. Each antenna element can be independently designed and optimized for specific frequency bands, while the overall system achieves broad bandwidth coverage through the combination of segmented elements. This segmentation allows for modular design and simplifies the integration process compared to designing a single complex antenna structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves efficient transmission of radio signals with reduced signal losses and compact size, supporting multiple frequency bands and polarization directions, thus addressing the need for small, high-performance antennas in communication devices.
Implementation Method 1
a feeding patch configured for capacitive feeding of the antenna patch
Data Source
AI summary
C-fed antenna formed on multi-layer printed circuit board edge A patch antenna (120) comprises an antenna patch (121) and a feeding patch (125) configured for capacitive feeding of the antenna patch (121). The antenna patch (121) is formed of multiple conductive strips (122) extending in a horizontal direction along an edge of a multi-layer printed circuit board (PCB). The multi-layer PCB has multiple layers stacked along a vertical direction. Each of the conductive strips (122) of the antenna patch (121) is arranged on a different layer of the multi-layer PCB. The conductive strips (122) are electrically connected to each other by conductive vias (123) extending between two or more of the conductive strips (122) of the antenna patch (121). The feeding patch (125) is formed of multiple conductive strips (126) extending in the horizontal direction. Each of the conductive strips (126) of the feeding patch (125) is arranged on a different layer of the multilayer PCB. The conductive strips (126) of the feeding patch are electrically connected to each other by conductive vias (127) extending between two or more of the conductive strips (126) of the feeding patch (125).