PCB Edge Connectors With 3D Contacts for High-Density Power Modules
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Solution Overview
Problem
Existing electronic power systems face challenges in achieving high power density while minimizing mounting area on customer motherboards and reducing costs, particularly in encapsulating power converters with inductive components like inductors and transformers.
Innovation Solution
A method and apparatus for electrically interconnecting circuit assemblies using conductive features embedded in the perimeter edge of a printed circuit board, where the conductive features form three-dimensional contacts for enhanced connectivity, allowing for efficient heat dissipation and reduced material usage through a panel molding process that integrates heat sink panels with contoured surfaces to match component heights.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power density is increased, then power throughput is improved, but mounting area on customer motherboard increases
Solution Approach 1:
The patent transitions from traditional planar surface mounting to three-dimensional edge mounting. Conductive features are embedded within the perimeter edge of the printed circuit board, utilizing the vertical and depth dimensions rather than only horizontal surface area. This allows power converters to be mounted along the edge with connections made through the board thickness, dramatically reducing the footprint on the motherboard surface while maintaining high power throughput capability.
Solution Approach 2:
The patent embeds conductive features within the perimeter edge structure of the printed circuit board. The conductive features are nested inside the board edge, integrated with the board structure itself rather than being separate surface-mounted components. This nesting approach allows multiple conductive connections to be packed into the edge volume, increasing power capacity without proportionally increasing mounting area.
2Area of stationary object
If mounting area is reduced, then cost is decreased, but power density decreases
Solution Approach 1:
By moving from two-dimensional surface mounting to three-dimensional edge embedding, the patent achieves higher power density in a smaller footprint. The edge-mounted configuration allows power converters to be positioned vertically along the board edge, utilizing the board's thickness dimension to accommodate higher power components without increasing the horizontal mounting area.
Solution Approach 2:
The patent changes the geometric parameters of the mounting configuration. Instead of spreading power converters across the board surface, they are concentrated along the perimeter edge at a different spatial location. This parameter change in mounting geometry enables higher power density achievement through compact edge placement rather than expansive surface distribution.
3Area of stationary object
If conductive features are embedded in perimeter edge, then mounting area is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent merges the conductive features with the perimeter edge structure of the printed circuit board, creating an integrated edge-mounted configuration. The conductive features are combined with the board's structural elements, allowing simultaneous formation of mechanical support and electrical connection functions. This merging reduces the need for separate mounting structures and simplifies the overall manufacturing process despite the innovative geometry.
Solution Approach 2:
The perimeter edge structure serves multiple functions simultaneously: it provides mechanical support for the power converters, establishes electrical connections through embedded conductive features, and enables compact mounting. This multi-functionality reduces the need for additional specialized components or processes, offsetting the initial complexity of the edge-embedding concept with operational simplicity.
4Reliability
If three-dimensional contacts are formed, then electrical connection is improved, but manufacturing precision requirements increase
Solution Approach 1:
The conductive features are embedded within the perimeter edge structure during board fabrication, before the power converters are mounted. This preliminary embedding ensures that the conductive features are pre-positioned with high precision relative to the board geometry, establishing accurate connection points before components are attached. The preliminary formation of conductive pathways reduces the precision burden on subsequent mounting operations.
Solution Approach 2:
The formation of three-dimensional contacts is merged with the board fabrication process itself. Rather than creating contacts as a separate post-processing step, the conductive features are integrated into the edge structure during manufacturing, allowing precision control through established PCB fabrication techniques. This merging of contact formation with board manufacturing leverages existing precision processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables increased power throughput, reduced losses in magnetic components, and cost-effective manufacturing by allowing thicker magnetic core structures and shorter windings, while maintaining thermal performance and mechanical integrity.
Implementation Method 1
a first circuit assembly and a second circuit assembly are electrically interconnected by a plurality of embedded conductive features
Implementation Method 2
Encapsulation in this manner may aid in conducting heat out of the over-molded components
Data Source
AI summary
Circuit assemblies can be electrically interconnected by providing a circuit assembly having a top surface, a bottom surface, and a perimeter edge connecting the top and bottom surfaces, the perimeter edge being formed of insulative material and having a plurality of conductive features embedded in and exposed on the surface of the edge. The conductive features are arranged in contact sets, and each contact set is separated from adjacent contact sets by a portion of the perimeter edge that is free of conductive features. Each contact set includes conductive features that together form a distributed electrical connection to a single node. The insulative material is selectively removed to form recesses adjacent the conductive features exposing additional surface contact areas along lateral portions of the conductive features in the recesses.