PCB Edge-to-Pad Connector Interface for High-Speed Signal Integrity
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Solution Overview
Problem
Existing electrical connectors face challenges in supporting high-speed signals with high density while maintaining signal integrity and efficient routing, particularly in configurations like direct attach orthogonal and midplane, where signal integrity issues arise due to geometry changes and mode conversion.
Innovation Solution
The development of electrical connectors with individually shielded modules and a mounting interface that includes signal conductors with compliant portions, aligned edge-to-pad connections, and efficient routing channels to maintain signal integrity and reduce mode conversion, enabling operation at frequencies up to 56 GHz with data transmission rates of 112 Gb/s.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If connectors are used in direct attach orthogonal or midplane configurations, then high density and efficient routing are achieved, but signal integrity deteriorates due to geometry changes and mode conversion
Solution Approach 1:
The connector is divided into individually shielded modules, each handling specific signal pairs. This segmentation isolates signals from each other, reducing crosstalk and mode conversion effects while maintaining the high-density routing capability of orthogonal configurations.
Solution Approach 2:
Each module within the connector has tailored shielding and geometry optimized for its specific signal requirements. This allows different regions of the connector to have different properties, maintaining signal integrity for high-speed signals while preserving overall routing efficiency.
2Speed
If high-speed signals are transmitted through orthogonal connectors, then data transmission rate increases, but crosstalk and impedance control become problematic
Solution Approach 1:
Individual shields act as intermediaries between adjacent signal modules, blocking electromagnetic interference and crosstalk while allowing high-speed signal transmission. These shields serve as the mediating structure that enables both high data rates and low crosstalk.
Solution Approach 2:
By segmenting the connector into isolated modules with individual shielding, high-speed signals can be transmitted at higher rates without crosstalk interference from adjacent signal pairs, as each module is electrically isolated.
3Ease of manufacture
If standardized components are used, then manufacturing cost decreases, but signal integrity and high-frequency performance become difficult to maintain
Solution Approach 1:
The connector design uses standardized housing and mounting structures that can be manufactured using conventional processes, while the internally shielded modules are designed to work together as a system. This universality allows cost-effective manufacturing while maintaining signal integrity through the modular shielded architecture.
Data Source
AI summary
An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.