PCB Edge Soldering for High-Density IC Packages
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Solution Overview
Problem
Current printed circuit boards (PCBs) face challenges in achieving high-density interconnects and compact packaging due to limitations in wire length reduction and component density, especially with traditional soldering methods that require sockets, which restrict the close placement of IC packages.
Innovation Solution
The implementation of edge solder pads formed directly on the lateral edges and surfaces of PCBs, using blind or through holes that are plated with conductive material, allows for dense IC package arrangements without the need for sockets, enabling higher connection density and efficient heat dissipation through comb-like structures with thermally conducting layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional soldering methods with sockets are used, then IC packages can be connected to PCBs, but the placement density of IC packages is restricted
Solution Approach 1:
The patent removes sockets from the connection system entirely. Instead of using sockets to connect IC packages to PCBs, the invention directly solderes IC packages to the PCB using edge solder pads formed from blind or through holes. This extraction of the socket component eliminates the space and structural complexity that sockets introduce, thereby enabling higher placement density of IC packages.
Solution Approach 2:
The patent transitions from traditional top-surface soldering to edge soldering along the lateral edges of the PCB. By forming solder pads on the edges of the PCB (using blind or through holes that are cut open at the lateral surface), the connection interface moves to a different spatial dimension (the edge), allowing IC packages to be placed closer together on the main surface without interfering with connection structures.
2Speed
If wire length between devices is reduced for higher integration, then speed improves, but component density becomes harder to achieve
Solution Approach 1:
The patent uses edge soldering along the lateral edges of the PCB, which allows IC packages to be arranged in dense configurations. By connecting at the edges rather than through the center, the layout can be optimized for both short wire lengths (improving speed) and high component density, as packages can be closely packed around the perimeter-connected PCB.
Solution Approach 2:
The patent divides the connection interface into multiple edge locations around the PCB perimeter. By distributing solder pads along the lateral edges rather than concentrating connections in one area, the design enables multiple IC packages to be connected with short trace lengths while maintaining high overall component density across the board.
3Quantity of substance
If blind holes are used for edge solder pads, then connection density increases, but manufacturing complexity increases
Solution Approach 1:
The patent incorporates blind hole creation and conductive material deposition as preliminary steps in the PCB manufacturing process, before the final cutting operation. By drilling blind holes, plating them with conductive material, and then cutting the PCB to expose the holes at the lateral surface, the complex blind hole structures are created during standard manufacturing operations, making the high-density connection achievable with existing fabrication capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of densely packed IC assemblies with reduced wire length, increased connection density, and effective heat dissipation, facilitating closer placement of IC packages and improved thermal management in high-density applications.
Implementation Method 1
using blind or through holes that are plated with conductive material
Implementation Method 2
efficient heat dissipation through comb-like structures with thermally conducting layers
Data Source
AI summary
The present invention is notably directed to a printed circuit board, or PCB. This PCB has two main surfaces, each delimited by lateral edges, as well as lateral surfaces, each meeting each of the two main surfaces at one lateral edge. The present PCB further comprises a row of solder pads, which extends along a lateral edge of the PCB. Each solder pad is formed directly at the lateral edge and/or directly on a lateral surface (meeting one of the two main surfaces at said lateral edge). I.e., each pad interrupts a lateral edge and/or an adjoining lateral surface. One or more chips, e.g., memory chips, can be mounted on such a PCB to form an IC package. The above solder pad arrangement allows particularly dense arrangements of IC packages to be obtained. The present invention is further directed to related devices and methods of fabrication thereof.