PCB Heat Dissipation via Electrode Cavity and Lateral Conduction
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Solution Overview
Problem
Existing printed circuit boards (PCBs) face challenges in achieving high heat radiation performance, particularly for high-power applications like head lamps, due to limitations in thermal resistance and increased manufacturing costs associated with using ceramic substrates, and the COB method offers lower thermal performance and higher costs without ceramic substrates.
Innovation Solution
A PCB design featuring a first electrode layer with a heat radiation function, a cavity for direct heat dissipation, and a connector unit for simplified external connections, which omits the need for a ceramic substrate and reduces manufacturing costs by using a heat-conductive insulating material and aluminum protective layers, allowing direct bonding of luminous elements for improved heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a ceramic substrate is used for LED package to improve heat radiation performance, then thermal resistance decreases, but manufacturing cost increases and vertical thermal resistance reduction is limited due to thickness requirements
Solution Approach 1:
The invention extracts the heat dissipation function from the traditional ceramic substrate and transfers it to the PCB's electrode layer. By forming the first electrode layer directly on the PCB with exposed regions, heat can be dissipated laterally through the conductive electrode layer without requiring a thick ceramic substrate, thus reducing manufacturing cost while maintaining thermal performance.
Solution Approach 2:
The first electrode layer is designed to serve multiple functions simultaneously: it acts as an electrical connection element for the LED and as a heat dissipation path. This multi-functional design eliminates the need for separate ceramic substrates dedicated to thermal management, reducing overall component cost and complexity.
2Ease of manufacture
If the COB method with Al2O3 insulation layer is used to decrease manufacturing cost by omitting ceramic substrate, then manufacturing cost decreases, but thermal resistance increases and withstand voltage characteristics deteriorate
Solution Approach 1:
Instead of using a uniform Al2O3 insulation layer across the entire mounting area, the invention creates localized exposed regions of the conductive electrode layer where LEDs are mounted. This local quality approach allows direct thermal contact between LEDs and the heat-conductive electrode layer in critical areas, while maintaining insulation elsewhere, thus achieving low thermal resistance without requiring expensive ceramic substrates.
3Reliability
If a thick ceramic substrate is formed to secure durability, then reliability improves, but vertical thermal resistance cannot be reduced further and manufacturing cost increases
Solution Approach 1:
The invention transitions from vertical heat dissipation through thick ceramic substrates to lateral heat dissipation through the PCB's electrode layer. By changing the heat flow direction from vertical to lateral/directional, the system achieves effective thermal management without requiring increased substrate thickness, thereby maintaining reliability while reducing vertical thermal resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat radiation performance, simplifies the connection method, reduces manufacturing costs, and effectively addresses the limitations of existing PCBs in high-power applications by integrating heat dissipation directly into the electrode layer, while maintaining efficient electrical connectivity.
Implementation Method 1
The second insulation layer may include a heat-conductive insulating material
Implementation Method 2
the first electrode layer may discharge heat generated by the semiconductor element to the outside
Data Source
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AI summary
The present invention relates to a printed circuit board having an improved heat radiation performance, and a light-emitting device including the same. A printed circuit board according to an embodiment of the present invention comprises: a first electrode layer, a first insulation layer disposed on one surface of the first electrode layer, the first insulation layer including at least a cavity formed through a part thereof; and a second electrode layer disposed on the first insulation layer, wherein at least a part of the one surface of the first electrode layer can be exposed to the outside through the cavity.