PCB Electrode Assembly for Blocking Ion Mirror Gap Fields
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Solution Overview
Problem
Existing electrode assemblies in ion optical devices face challenges in preventing electrical charge buildup on insulating substrates, which affects the electrical potential profile and allows external electric fields to penetrate, limiting the precision and voltage applications due to the limitations in gap width and depth ratios.
Innovation Solution
An electrode assembly with a first layer having electrodes separated by gaps, covered by a second conductive layer that prevents electric fields from passing through, using printed circuit boards (PCBs) for both layers to maintain manufacturing ease and precision, with conductive material located coincident with gaps to manage charge and electric fields effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If gaps are made between electrodes to prevent charge buildup, then charge accumulation is reduced, but external electric fields penetrate through the gaps
Solution Approach 1:
The patent applies nesting by placing a second PCB layer inside the gap region of the first PCB layer. The second layer's conductive material is positioned within the gap space of the first layer, creating a nested structure where one electrode assembly is embedded within the gap region of another, effectively blocking external fields while maintaining gap functionality.
Solution Approach 2:
The patent transitions from a two-dimensional gap structure to a three-dimensional solution by adding a second PCB layer that extends into the gap region. This dimensional change allows the conductive material to block external electric fields in the third dimension while maintaining the original gap's charge dissipation function.
2Object-affected harmful factors
If gap width is reduced to prevent field penetration, then field blocking improves, but voltage application capability decreases due to breakdown risk
Solution Approach 1:
The nested structure allows the second layer's conductive material to extend into the gap region, providing field blocking without requiring the gap width itself to be reduced. This maintains adequate spacing between electrodes while still preventing external field penetration.
Solution Approach 2:
By solving the field penetration problem in the third dimension (adding depth with the second layer) rather than reducing gap width in the second dimension, the patent maintains larger electrode spacing and reduces breakdown risk while still blocking external fields.
3Object-affected harmful factors
If groove depth is increased to prevent field penetration, then field blocking improves, but groove width and electrode spacing are limited
Solution Approach 1:
The patent uses nesting to place the second layer's conductive material within the gap region of the first layer, achieving field blocking without requiring deep grooves. The conductive material is positioned at a different spatial location (within the gap) rather than requiring deep excavation into the substrate.
Solution Approach 2:
Instead of increasing groove depth vertically into the substrate, the patent achieves field blocking by adding a second layer that extends into the gap region horizontally/laterally, changing the approach from depth-based blocking to layered spatial blocking.
4Manufacturing precision
If PCB technology is used for electrode structures, then manufacturing precision is improved, but charge buildup on insulating substrate occurs
Solution Approach 1:
The patent extracts the problematic insulating substrate material from the gap regions by creating gaps between electrodes where the insulating material is removed or not present. This allows charged particles to pass through without accumulating charge on the substrate surface.
Solution Approach 2:
The second PCB layer is nested within the gap region of the first layer, and its conductive material is positioned to block external fields. This nested conductive structure prevents charge buildup by providing a conductive path while maintaining the gap's charge dissipation function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents unwanted charge buildup and external electric field penetration, allowing for higher precision and voltage applications, enabling finer and more accurate electrode features, such as high ion focusing in ion mirrors, while maintaining manufacturing ease and cost-effectiveness.
Implementation Method 1
at least one second layer arranged to cover said one or more gaps and prevent electric fields passing through said one or more gaps
Implementation Method 2
said at least one second layer having electrically conductive material located to be coincident with said one or more gaps in the first layer
Data Source
AI summary
An electrode assembly, such as for an ion mirror, comprising: a first layer having a plurality of electrodes that are separated by one or more gaps; a second layer arranged to cover said one or more gaps and prevent electric fields passing through said one or more gaps, said second layer having electrically conductive material located to be coincident with said one or more gaps in the first layer.