PCB Inspection Electrostatic Adsorption Fixing Wrinkles
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Solution Overview
Problem
Existing automatic visual inspection (AVI) methods for printed circuit boards face challenges in accurately fixing and inspecting boards due to issues like wrinkling, uneven suction, and insufficient electrostatic adsorption, leading to inaccurate defect detection.
Innovation Solution
A method involving an adsorption platform with an insulating support surface that uses an electrostatic charge to fix printed circuit boards uniformly, combined with a pressing member made of insulating materials like glass or resin to prevent discharge and ensure accurate positioning and removal of foreign matters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a clamp mechanism is used to fix the printed circuit board, then the board can be held securely, but wrinkles are generated on the board due to tensile force
Solution Approach 1:
The patent replaces the mechanical clamp system with an electrostatic adsorption system. The adsorption platform uses electrostatic forces to hold the printed circuit board without mechanical contact, eliminating the tensile forces that cause wrinkles while maintaining secure fixation during inspection
2Reliability
If a vacuum suction mechanism is used to fix the printed circuit board, then the board can be adsorbed onto the platform, but uneven suction force causes strain in the board
Solution Approach 1:
The patent replaces the vacuum suction mechanism with an electrostatic adsorption system. The electrostatic field provides uniform attraction force across the entire board surface, eliminating the localized uneven suction forces that cause strain and deformation
Solution Approach 2:
The patent changes the physical parameter of the adsorption mechanism from pneumatic (vacuum pressure) to electrostatic (electric field). This parameter change enables uniform force distribution across the board surface, preventing localized strain while maintaining effective fixation
3Shape
If electrostatic adsorption is used to fix the printed circuit board, then the board can be held without mechanical contact, but sufficient adsorption force cannot be obtained when the board is not in close proximity to the platform
Solution Approach 1:
The patent applies a pressing member to press the printed circuit board against the adsorption platform before electrostatic adsorption is activated. This preliminary action ensures close proximity between the board and platform, enabling sufficient electrostatic adsorption force to be generated when the electrostatic field is applied
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for reliable and accurate automatic appearance inspection by maintaining the board in a flattened state, preventing discharge and ensuring thorough inspection while removing foreign matters, thus enhancing the precision of defect detection.
Implementation Method 1
adsorbing the printed circuit board on the support surface by an electrostatic force by charging the support surface
Implementation Method 2
placing a pressing member on the printed circuit board placed on the support surface such that the printed circuit board is pressed by an insulating pressing surface of the pressing member
Data Source
AI summary
A plurality of assembly sheets are placed on an upper surface of a substrate adsorption platform, and a pressing plate is placed on the plurality of assembly sheets placed on the substrate adsorption platform such that the plurality of assembly sheets are pressed by the pressing plate. In this state, a DC power supply device is turned on and causes the upper surface of the substrate adsorption platform to be charged, thereby causing the plurality of assembly sheets to be adsorbed on the upper surface by an electrostatic force. Then, the pressing plate placed on the plurality of assembly sheets is removed while the upper surface of the substrate adsorption platform is charged, and automatic appearance inspection is performed on the plurality of assembly sheets adsorbed on the upper surface of the substrate adsorption platform.