Printed Wiring Board With Embedded Component Resin Layers
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Solution Overview
Problem
Existing printed wiring boards with built-in electronic components face challenges in accommodating thin electronic components without compromising the strength and reliability of the substrate, often resulting in warping or damage to the components due to the thickness and structural integrity issues.
Innovation Solution
A printed wiring board design featuring a core substrate with multiple resin layers, through-hole conductors formed by filled vias, and interlayer resin insulation layers with reinforcing materials, which allows for the accommodation of thin electronic components like chip capacitors while maintaining the strength and reducing warping risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the core substrate uses a simple single-layer structure, then the manufacturing process is simpler, but the structural integrity and strength are insufficient to support thin electronic components without warping
Solution Approach 1:
The core substrate is divided into multiple resin layers (first resin layer, second resin layer, third resin layer) with distinct functions. The first and second resin layers provide structural support and strength, while the third resin layer accommodates the electronic component. This segmentation allows each layer to be optimized for its specific purpose, achieving both strength and manufacturing feasibility.
Solution Approach 2:
The substrate employs a composite structure combining multiple resin materials with different properties. The first and second resin layers use materials with high strength and rigidity to prevent warping, while the third resin layer uses a material suitable for component accommodation. This composite approach achieves optimal balance between strength, manufacturability, and component integration.
2Strength
If the core substrate uses a thick structure to maintain strength, then the structural integrity is improved, but thin electronic components cannot be properly accommodated without damage or warping
Solution Approach 1:
Different regions of the substrate have different thicknesses and material properties tailored to local requirements. The first and second resin layers maintain sufficient thickness for structural strength, while the third resin layer is positioned specifically to accommodate the thin electronic component. The interlayer resin insulation layers are strategically placed to provide support where needed without excessive overall thickness that would harm component integrity.
Solution Approach 2:
The substrate structure incorporates protective features in advance to prevent damage to thin components. The multiple resin layers and interlayer insulation layers are designed to provide cushioning and support before the component is mounted, preventing warping and damage during assembly and operation. The opening portion is precisely controlled to match component dimensions, providing a protective cavity.
3Ease of operation
If the opening portion for accommodating the electronic component is made larger, then the component can be easily installed, but the structural strength and rigidity of the substrate are reduced
Solution Approach 1:
The opening portion is precisely localized to the third resin layer where component accommodation is needed, without compromising the first and second resin layers that provide structural rigidity. The opening dimensions are optimized to match the specific component size, providing easy installation while minimizing the impact on overall substrate strength. The interlayer resin insulation layers compensate for the localized material removal.
Data Source
AI summary
A printed wiring board includes a core substrate, an electronic component accommodated in the substrate, a first buildup structure formed on surface of the substrate and including an interlayer insulation layer, and a second buildup structure formed on the opposing surface of the substrate and including an interlayer insulation layer. The substrate includes a core material portion including multiple resin layers, a first conductive layer formed on first surface of the core portion and a second conductive layer formed on second surface of the core portion, the core portion has opening through the resin layers and accommodating the component, the insulation layer of the first structure is positioned such that the opening of the core portion is covered on the first surface, and the insulation layer of the second structure is positioned such that the opening of the core portion is covered on the second surface.