PCB-Embedded Power Module With Busbar Cavities for Higher Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge is to create a power module that is smaller in size, more compact in structure, and higher in integration level.
Innovation Solution
The power module incorporates semiconductor chips and a busbar arrangement, where the AC busbar has cavities for first semiconductor chips, and the DC+ busbar has cavities for second semiconductor chips. Each semiconductor chip is electrically connected to the busbars, and the busbars are embedded into a printed circuit board (PCB).
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor chips are arranged on the surface of busbars, then the power module achieves electrical connection, but the module occupies more space and has larger size
Solution Approach 1:
The patent embeds semiconductor chips inside cavities of the busbar structure, nesting the chips within the existing busbar volume rather than placing them on the surface. This nesting approach allows the chips to occupy space already allocated for electrical connection, eliminating the need for separate mounting space and reducing overall module size.
Solution Approach 2:
The patent transitions from two-dimensional surface mounting of chips on busbars to three-dimensional integration by embedding chips within the busbar's internal cavities. This dimensional change utilizes the vertical depth of the busbar structure, transforming the arrangement from a planar configuration to a volumetric one, thereby reducing the module's footprint.
2Volume of moving object
If busbars are placed on top of PCB without embedding, then assembly is simpler, but the module occupies more space
Solution Approach 1:
The patent merges the busbar and PCB into a single integrated structure by embedding the busbars directly into the PCB. This combination eliminates the need for separate busbar mounting steps, as the busbars become part of the PCB assembly process itself, thereby simplifying manufacturing while reducing overall module volume.
Solution Approach 2:
The busbars are pre-embedded into the PCB during the PCB manufacturing process rather than being attached separately afterward. This preliminary action integrates the electrical connection structure into the base board itself, eliminating subsequent assembly steps and reducing the space required for separate busbar mounting areas.
3Power
If traditional surface mounting is used, then manufacturing is easier, but the power density is lower
Solution Approach 1:
By nesting semiconductor chips within the internal cavities of busbars, the patent increases the number of chips that can be accommodated within the same external dimensions. This nesting configuration directly increases power density by utilizing the busbar's internal volume for additional functional elements rather than merely surface placement.
Data Source
Figure 1~3
Figure 4~6
AI summary
The disclosure provides a power module, including semiconductor chips and a busbar, where each of the semiconductor chips includes a first semiconductor chip and a second semiconductor chip, and the busbar includes a DC- busbar, an AC busbar and a DC+ busbar arranged in sequence. The AC busbar has a plurality of first cavities therein, each of the first cavities having one of the first semiconductor chip arranged therein, and the DC+ busbar has a plurality of second cavities therein, each of the second cavities having one of the second semiconductor chips arranged therein. Each of the first semiconductor chips has a source electrically connected to the DC- busbar and a drain electrically connected to the AC busbar, each of the second semiconductor chips has a source electrically connected to the AC busbar and a drain electrically connected to the DC+ busbar, and the DC- busbar, the AC busbar and the DC+ busbar are all embedded into a PCB. The power module according to the disclosure is smaller in size, more compact in structure and higher in integration level.