PCB Enclosure With Vapor Chamber for Isothermal Cooling
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Solution Overview
Problem
Memory sub-systems face thermal challenges due to unbalanced heat distribution, leading to potential data loss and damage from overheating, which existing thermal throttling mechanisms fail to adequately address.
Innovation Solution
Implementing a hybrid memory/storage sub-system with a PCB assembly secured between a heat spreader and a heat sink, utilizing a vapor chamber to thermally couple top and bottom enclosures, and employing fasteners and thermal gap pads to enhance heat transfer and balance temperature across the PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal throttling is used to prevent overheating, then data loss and damage are prevented, but processing speed is reduced
Solution Approach 1:
The patent applies preliminary action by implementing a vapor chamber and heat spreader before overheating occurs. These thermal management components are pre-installed to actively distribute and dissipate heat, preventing thermal throttling from being triggered in the first place, thus maintaining high processing speed while ensuring reliability.
2Loss of energy
If heat is concentrated in specific areas, then heat transfer efficiency is improved, but hot spots cause localized overheating and damage
Solution Approach 1:
The patent applies local quality by using a vapor chamber with phase change material that provides enhanced thermal conduction in specific regions. The heat spreader also features localized thermal pathways that direct heat away from high-heat-generation areas, preventing hot spots while maintaining efficient overall heat transfer.
Solution Approach 2:
The patent utilizes phase transitions within the vapor chamber to manage heat distribution. The phase change material absorbs and redistributes heat through phase transitions, preventing localized overheating while maintaining efficient heat transfer across the PCB.
3Temperature
If thermal management components are added, then heat distribution is improved, but device complexity increases
Solution Approach 1:
The patent applies merging by integrating the vapor chamber, heat spreader, and thermal vias into a unified thermal management system. These components work together as a cohesive assembly that improves heat distribution while minimizing the increase in device complexity through shared structural elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively balances heat transfer, increasing the amount of heat that can be generated before thermal throttling, enhancing component reliability and flexibility in design by evenly distributing heat and preventing hot spots.
Implementation Method 1
utilizing a vapor chamber to thermally couple top and bottom enclosures
Implementation Method 2
a bottom heat spreader allowing distribution of heat among components on a bottom of the PCB
Implementation Method 3
a top portion of the enclosure... configured to transfer heat from the bottom heat spreader to the top portion
Data Source
AI summary
Aspects of the present disclosure are directed to a memory sub-system with isothermal cooling of components. A PCB assembly may be secured between a heat spreader and a heat sink that are thermally coupled. The heat sink radiates heat absorbed from both sides of the PCB assembly. By connecting the heat spreader to the heat sink, heat is more effectively transferred from the side of the PCB assembly not directly connected to the heat sink. The PCB assembly may be secured between a top enclosure and a bottom enclosure. The top enclosure and the bottom enclosure may be thermally coupled using a vapor chamber. The vapor chamber pumps heat from a higher-temperature side of the PCB assembly to a lower-temperature side of the PCB assembly. By using the vapor chamber to thermally couple the top and bottom enclosures, creation of hot spots is avoided.