PCB Exposed Copper Area for Source Driver Chip Heat Dissipation

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Solution Overview

Problem

Conventional display devices face challenges with high temperatures of the source driver chip due to inadequate heat dissipation, leading to increased production costs from additional heat dissipation attachments.

Innovation Solution

A display device design featuring a flexible circuit board connected to a printed circuit board, with a source driver chip bonded to the PCB and an exposed copper area on the PCB's backside, utilizing an auxiliary graphene heat dissipation layer and thermal conductors to enhance heat dissipation, eliminating the need for additional heat dissipation fins.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If additional heat dissipation attachments are added to the source driver chip, then heat dissipation capability is improved, but production costs increase and device complexity increases

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidproduction cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent merges the heat dissipation function with the existing PCB structure by creating an exposed copper area on the PCB backside that directly contacts the driver chip. This integration eliminates the need for separate heat dissipation attachments, reducing both cost and complexity while improving thermal management through direct thermal coupling between the chip and PCB copper layers.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The PCB is designed to serve multiple functions: electrical connection, mechanical support, and heat dissipation. The exposed copper area on the PCB backside acts as both an electrical trace and a heat dissipation path, allowing the same component to fulfill multiple roles and eliminating redundant heat dissipation attachments.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If additional heat dissipation attachments are added to the source driver chip, then heat dissipation capability is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the heat dissipation function with the existing PCB structure by creating an exposed copper area on the PCB backside that directly contacts the driver chip. This integration eliminates the need for separate heat dissipation attachments, reducing both cost and complexity while improving thermal management through direct thermal coupling between the chip and PCB copper layers.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If conventional heat dissipation methods are used, then heat dissipation is provided, but heat dissipation effectiveness is insufficient

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoidworking stability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent extracts the heat dissipation function from separate attachments and integrates it directly into the PCB structure through an exposed copper area. This extraction and reintegration creates a more effective thermal path by eliminating thermal interface materials and direct contact resistance, thereby improving heat dissipation effectiveness and driver chip working stability.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves heat dissipation efficiency, reduces production costs, and ensures the working stability and reliability of the source driver chip by effectively managing heat dissipation without additional fins.

Implementation Method 1

an exposed copper area is disposed on a backside of the PCB corresponding to the driver chip

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

An auxiliary heat dissipation layer is disposed on a side of the exposed copper area away from the source driver chip. A material of the auxiliary heat dissipation layer is graphene.

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

The display device comprises at least one thermal conductor, at least one through hole is defined in the PCB, one of the at least one the thermal conductor is disposed in each of the at least one through hole, an end of the at least one thermal conductor is in contact with the exposed copper area, and the other side of the at least one thermal conductor is in contact with the source driver chip.

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11191194B2Display device

Publication Date: 2021.11.30 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD

AI summary

The disclosure provides a display device, including a display panel, a flexible circuit board (FCB), a printed circuit board (PCB), and a source driver chip. The PCB is connected to the display panel by the FCB, the source driver chip is bonded to a front side of the PCB, and an exposed copper area is disposed on a backside of the PCB corresponding to the source driver chip. Therefore, heat dissipation effect of a chip is improved, production costs are reduced, and working stability of products is ensured.