PCB Fault Detection via Node Location Outputs
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Solution Overview
Problem
Existing probing systems for testing printed circuit boards are error-prone and time-consuming, especially when dealing with complex PCBs with multiple layers and high noise levels, and they often impede the use of vision systems due to the presence of probe mounts.
Innovation Solution
A testing system and method that incorporates nodes with signal, ground, and location outputs on a printed circuit board, allowing a testing apparatus to probe these nodes and determine the location of faults by processing signals from the location outputs, which can be identified by unique resistance values or digital reference inputs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flying probe testing is used to test PCBs, then versatility and adaptability to different PCB constructions is improved, but testing speed and productivity deteriorate
Solution Approach 1:
The patent applies preliminary action by pre-positioning multiple probes on a movable carrier before approaching the PCB. The carrier is programmed with predetermined test site locations, allowing the probe assembly to be rapidly transported to multiple test points in a single motion sequence rather than positioning probes individually at each test site. This pre-positioning strategy maintains versatility across different PCB constructions while significantly improving testing speed through batched probe movements.
2Reliability
If traditional probing systems are used on complex PCBs with multiple layers, then comprehensive fault detection is improved, but error rates and time consumption increase
Solution Approach 1:
The patent replaces traditional mechanical probing systems with an automated movable carrier system that transports probe assemblies to predetermined test sites. The carrier mechanism substitutes manual or semi-automated probe positioning with a programmable transport system that can rapidly move multiple probes to various locations on complex multi-layer PCBs. This mechanical substitution maintains comprehensive fault detection capability while reducing testing time through automated, coordinated probe movements.
3Ease of operation
If probe mounts are present on PCBs for testing, then testing functionality is improved, but use of vision systems deteriorates due to obstruction
Solution Approach 1:
The patent resolves the vision system obstruction problem by moving the probe mounts from the PCB surface to a separate movable carrier that approaches the PCB from above. This dimensional relocation separates the testing function (probes on carrier) from the visual inspection function (unobstructed access to PCB surface). The carrier can be positioned and moved in the vertical dimension, allowing vision systems to capture images of the PCB plane without interference from probe mounting structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces error rates and noise levels by accurately determining the location of faults on complex PCBs, improving the efficiency of the testing process and allowing for the use of vision systems without interference from probe mounts.
Implementation Method 1
Each of the nodes include a signal output, a ground output and a location output... the location output includes a first resistor and the resistance value of each of the resistors is different from each other so as to identify the location of the node in which the fault is detected
Data Source
AI summary
A testing system including a testing apparatus and a controller for detecting a location of a fault in printed circuit board is provided. The printed circuit board includes at least two nodes each including a signal output, a ground output and a location output. The testing apparatus includes a signal input, a ground input and a location input configured to engage a corresponding signal input, ground input and location output of the nodes. The controller is electrically coupled to the testing apparatus and is configured to receive a test signal from the signal input, a reference ground from the ground input and a location from the location input, wherein the controller is further configured to process a signal from the location output and a signal received by the signal input, wherein the controller provides a location of the node where a fault is detected.