Printed Wiring Board Feed-Through Capacitor for High Power
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Solution Overview
Problem
There is a need for a feed-through capacitor that can effectively operate in high power and high current applications, as traditional capacitors with ceramic dielectric layers are brittle and unsuitable for such circuits, lacking a simple and cost-effective solution for industrial use.
Innovation Solution
A feed-through capacitor is constructed using a printed wiring board with a multi-layer stack of metal and polymer dielectric materials, eliminating the need for ceramic layers and allowing for high capacitance, flexibility in size and shape, and integration into circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If ceramic dielectric layers are used to increase capacitance for high power applications, then capacitance increases, but the capacitor becomes brittle and difficult to manufacture
Solution Approach 1:
The patent changes the material parameters from ceramic to polymer dielectric, and from discrete capacitor construction to integrated printed wiring board construction. This allows achieving high capacitance values while maintaining mechanical flexibility and ease of manufacture, directly resolving the contradiction between increasing capacitance for high power applications and maintaining mechanical strength.
2Quantity of substance
If large ceramic discs are used to achieve high capacitance, then capacitance increases, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the capacitor construction with the printed wiring board structure, integrating the dielectric layer and conductive elements directly into the circuit board. This eliminates the need for separate large ceramic discs and complex assembly processes, achieving high capacitance while simplifying manufacturing and reducing costs.
Solution Approach 2:
The patent transitions from three-dimensional ceramic disc capacitors to a planar multi-layer structure within the printed wiring board. By utilizing the z-dimension (thickness) of the board for multiple stacked capacitor layers, high capacitance is achieved without requiring large surface area or complex three-dimensional ceramic structures.
3Reliability
If traditional feed-through capacitors are used for high current applications, then filtering capability is maintained, but the capacitor cannot handle high power and high current
Solution Approach 1:
The patent uses composite construction combining polymer dielectric material with conductive traces and plated through-holes in a multi-layer printed wiring board structure. This composite approach enables the capacitor to simultaneously provide effective high-frequency filtering and handle high power and high current applications, resolving the contradiction between maintaining filtering capability and increasing power handling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a sturdy, cost-effective, and versatile feed-through capacitor capable of handling high power and high current applications, with increased reliability and flexibility in design, suitable for industrial use.
Implementation Method 1
a capacitive element surrounds the stud and is coupled to both the stud and the inside of the chassis wall. The capacitive element provides a low impedance path from the stud to the chassis wall
Implementation Method 2
Most feed-through capacitors utilize ceramic discs as their dielectric layer... A feed-through capacitor is constructed using a printed wiring board with a multi-layer stack of metal and polymer dielectric materials
Implementation Method 3
it filters unwanted high-frequency electromagnetic interference from an electrical circuit... High frequencies, in contrast, are shunted from the stud to the chassis
Data Source
AI summary
A feed-through capacitor is constructed in a printed wiring board using alternating layers of metal capacitive layers and plastic dielectric layers of the printed wiring board. The large number of layers, the avoidance of ceramic layers and the flexible geometry of this device allow it to be used in many applications, particularly in those involving high power high current. Also, because it utilizes a printed wiring board, the capacitor can be made in numerous sizes and shapes.