PCB Feed-Thru Interconnects for High-Speed Transponders
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Solution Overview
Problem
High-speed transponders require multiple interconnects, which increase complexity and cost due to the use of coax cables and GPPO or V- connectors, limiting market potential.
Innovation Solution
The development of high-speed interconnects using printed circuit boards (PCBs) with coplanar and non-coplanar structures, including feed thrus with flipped signal planes, to connect integrated circuits and optoelectric circuits, reducing the need for expensive coax cables and specialized connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If coax cable and GPPO or V-connectors are used as high-speed interconnects, then signal transmission reliability is improved, but device complexity and cost increase
Solution Approach 1:
The patent merges multiple separate interconnect functions into a single integrated PCB structure. The feed-thru component integrates multiple transmission lines, ground references, and signal routing functions that would otherwise require separate coax cables and connectors, thereby reducing device complexity while maintaining signal integrity through controlled impedance design
Solution Approach 2:
The patent replaces mechanical interconnect systems (coax cables, connectors, and manual assembly) with a printed circuit board-based electrical interconnect system. This substitution eliminates the need for mechanical coupling and manual cable routing, reducing complexity through standardized PCB manufacturing processes while maintaining high-speed signal transmission capability
2Reliability
If multiple coax cables and connectors are used for high-speed interconnects, then signal transmission quality is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple interconnect functions into a single feed-thru component manufactured as an integrated PCB assembly. This merging reduces the total number of discrete parts (cables, connectors, mounting hardware) that require procurement, inventory management, and assembly, thereby reducing manufacturing cost while maintaining signal quality through controlled impedance design
Solution Approach 2:
The patent changes the physical and electrical parameters of the interconnect system by transitioning from discrete coaxial structures to planar PCB traces with controlled impedance. This parameter change enables standardization and automation in manufacturing, reducing labor costs and variability while maintaining signal integrity through precise impedance control achieved through trace geometry and substrate material selection
3Reliability
If multiple differential interconnects are employed in transmitter and receiver chains, then signal transmission reliability is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple differential signal paths into a single integrated feed-thru structure on the PCB. This consolidation reduces the number of discrete interconnect components and their associated mounting, routing, and shielding requirements, thereby reducing device complexity while maintaining differential signal integrity through symmetric trace routing and controlled impedance design
Data Source
AI summary
In one example embodiment, a high-speed transponder includes a printed circuit board having a set of coplanar high-speed traces, and a high-speed circuit and a package mounted to the printed circuit board. The package includes an outside housing and a second high-speed circuit positioned inside the housing. The high-speed transponder also includes a high-speed feed thru which includes an inside coplanar structure positioned inside the housing, a strip line structure positioned through the housing, and an outside coplanar structure positioned outside the housing. The second high-speed circuit is operably coupled to the inside coplanar structure, which is operably coupled to the strip line structure, which is operably coupled to the outside coplanar structure, which is operably coupled to the first high-speed circuit via the set of coplanar high-speed traces. The signal plane of the outside coplanar structure is flipped with respect to a signal plane of the inside coplanar structure.